Broadcom Unveils Sian 2 DSP: Powering Next-Generation AI Cluster Connectivity with 200G/Lane Interfaces

Broadcom has introduced the Sian 2 DSP, featuring 200G/lane electrical and optical interfaces, designed to complement the existing Sian DSP with its 100G electrical and 200G optical support. These advancements enable pluggable modules with 200G/lane interfaces, laying the foundation for connecting next-generation AI clusters that demand faster, more efficient, and scalable network solutions.

As AI model sizes continue to grow, the need for high-performance, low-latency, and resilient connectivity becomes increasingly critical. To accommodate the rapid expansion of AI clusters, industry demands are shifting towards optical network solutions that offer higher bandwidth, reduced power consumption, and lower costs, all while ensuring optimal performance.

Transition from 400G/800G to 800G/1.6T for AI Cluster Growth

Currently, AI clusters are leveraging 400G/800G links with 100G/lane optics, but the increasing demands of AI workloads require a migration to 800G and 1.6T links with 200G/lane optics. The Sian 2 DSP is designed to facilitate this transition, ensuring AI clusters can scale up and scale out to support next-generation workloads.

Broadcom’s DSPs, optimized for 800G and 1.6T optical module platforms, deliver enhanced performance by doubling bandwidth while lowering power consumption, latency, and cost per bit—key factors in supporting AI data center growth.

Broadcom’s Commitment to AI Infrastructure

“200G/lane DSP is foundational to high-speed optical links for next-generation scale-up and scale-out networks in AI infrastructure,” explained Vijay Janapaty, vice president and general manager of Broadcom’s Physical Layer Products Division. He emphasized that the Sian family of products reinforces Broadcom’s leadership in optical DSP PHYs, enabling AI data center customers to deploy high-performance 800G and 1.6T links.

Best-in-Class Performance with Sian 2 DSP and 200G/Lane Optics

In addition to Sian 2, Broadcom’s optical portfolio includes 200G/lane optics such as electro-absorption modulated lasers (EML) and continuous wave lasers (CWL), which work seamlessly to deliver top-tier performance with optimized power efficiency. This combination enables data center operators to effectively scale AI workloads, driving down operational costs while enhancing performance.

AI Market Anticipates 200G/Lane Optical Module Adoption by 2025

Dr. Vlad Kozlov, CEO and Chief Analyst at LightCounting, noted that AI market leaders are expected to begin large-scale adoption of optical modules using 200G/lane interfaces by 2025. He highlighted the intense competition in the AI sector, with projections of over 1 million units of 1.6T optical transceivers to be deployed within the first 12 months—a scale-up rate unprecedented in the industry.

Conclusion: Driving the Future of AI with 200G/Lane Technology

Broadcom’s Sian 2 DSP represents a pivotal development in the quest for faster, more efficient AI cluster connectivity. By offering scalable, high-speed 200G/lane interfaces, Broadcom is enabling the AI industry to meet the growing demands of next-generation workloads, ensuring AI infrastructure can continue to evolve with minimal cost, power, and latency, while maximizing performance.

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