Amkor Technology and TSMC Collaborate to Expand Advanced Packaging and Test Capabilities in Arizona
Advanced Packaging: As part of the agreement, TSMC will contract Amkor to provide turnkey advanced packaging and test services
Amkor Technology and TSMC have signed a memorandum of understanding to collaborate on bringing advanced packaging and testing capabilities to Arizona, enhancing the region’s semiconductor ecosystem. This agreement builds on the longstanding partnership between the two companies in delivering high-volume, cutting-edge technologies for semiconductor packaging and testing, targeting critical markets such as high-performance computing and communications.
As part of the agreement, TSMC will contract Amkor to provide turnkey advanced packaging and test services at Amkor’s upcoming facility in Peoria, Arizona. These services will support TSMC’s customers, especially those utilizing TSMC’s advanced wafer fabrication facilities in Phoenix. By having TSMC’s front-end fabrication and Amkor’s back-end services located in close proximity, the partnership will accelerate overall product cycle times and improve efficiency.
Both companies will collaborate to define specific packaging technologies, including TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS), to meet the needs of mutual customers.
This partnership highlights the shared commitment to providing geographic flexibility in semiconductor manufacturing, fostering a comprehensive semiconductor ecosystem in the U.S., and aligning technology seamlessly across the global supply chain.
Giel Rutten, President and CEO of Amkor, said,
“Amkor is proud to collaborate with TSMC to integrate silicon manufacturing and packaging processes through an efficient turnkey model in the U.S. This partnership underscores our commitment to innovation and advancing semiconductor technology while ensuring resilient supply chains.”
Dr. Kevin Zhang, TSMC’s Senior Vice President of Business Development and Global Sales, added,
“As our customers increasingly depend on advanced packaging technologies for breakthroughs in mobile applications, AI, and high-performance computing, we are pleased to collaborate with our trusted partner Amkor. Together, we will support a more diverse manufacturing footprint and maximize the value of our Phoenix fabs.”
For more information about Amkor’s Arizona operations, visit Amkor Technology.
