In the rapidly evolving landscape of artificial intelligence (AI) and high-performance computing, Infineon Technologies , a global leader in power systems and IoT solutions 8, has introduced its next-generation high-density power modules. These cutting-edge OptiMOS™ TDM2454xx quad-phase power modules are designed to redefine vertical power delivery (VPD) in AI data centers by delivering unparalleled power density, superior efficiency, and reduced total cost of ownership (TCO).
Industry-Leading Power Density for AI Compute Platforms
The OptiMOS TDM2454xx modules represent a breakthrough in power delivery technology, offering an industry-best current density of 2 Ampere per mm² . This innovation builds on Infineon’s earlier successes with the OptiMOS TDM2254xD and TDM2354xD dual-phase power modules , which set new benchmarks for power density in accelerated compute platforms 9. Unlike traditional horizontal power delivery systems that suffer from higher resistance and significant power loss due to longer travel distances, vertical power delivery minimizes resistive losses by shortening the power path. This results in enhanced system performance and energy efficiency, making it ideal for AI-driven workloads.
Addressing the Growing Energy Demands of Data Centers
Data centers currently account for approximately 2% of global energy consumption , a figure expected to surge by 165% between 2023 and 2030 , fueled by the exponential growth of AI applications [[contextual addition]]. To meet these escalating demands while reducing environmental impact, improving power conversion efficiency from grid-to-core is critical. The OptiMOS TDM2454xx modules address this challenge by providing a compact, energy-efficient solution that supports up to 280A across four phases within a small 10x9mm² form factor . This innovative design not only enhances electrical and thermal performance but also integrates an embedded capacitor layer for improved power stability.
A Three-Dimensional Approach to Power Innovation
Infineon’s commitment to driving digitalization and decarbonization is evident in its advanced engineering approach. “We are proud to expand our high-performance AI data center solutions with the OptiMOS TDM2454xx VPD modules ,” said Rakesh Renganathan, Vice President of Power ICs at Infineon Technologies. “By leveraging our industry-leading power devices, packaging technologies, and extensive systems expertise, we provide robust, energy-efficient computing solutions that push the boundaries of innovation”.
The modules combine Infineon’s proprietary OptiMOS 6 trench technology with a chip-embedded package designed for superior electrical and thermal efficiencies. Additionally, their innovative low-profile magnetic design ensures optimal mechanical performance, further enhancing reliability in demanding environments.
Modular Design for Enhanced Performance
The OptiMOS TDM2454xx modules feature a footprint optimized for module tiling, enabling seamless integration into existing systems while improving current flow. When paired with Infineon’s XDP™ controllers , these modules deliver a comprehensive power solution that maximizes system power density and operational efficiency. Their ability to support diverse AI server configurations—from grid to core—positions them as a versatile and indispensable tool for modern data centers.
Strengthening Infineon’s Market Leadership
With the introduction of the OptiMOS TDM2454xx modules , Infineon solidifies its position as a market leader with the broadest portfolio of semiconductor materials and technologies tailored for AI applications. By addressing the growing need for energy-efficient power solutions, Infineon continues to drive advancements in compute performance while contributing to global sustainability goals.
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