Faraday Technology Expands Use of Ansys Solutions to Advance 2.5D/3D-IC Designs for AI, IoT, and 5G

Faraday Technology Corporation, a key player in the semiconductor industry, is expanding its collaboration with Ansys to enhance its capabilities in developing advanced 2.5D/3D-IC designs, crucial for artificial intelligence (AI), IoT, and 5G applications. With Ansys’ support, Faraday will empower its customers to explore more innovative design options, driving the development of cutting-edge products.

As a leading provider of ASIC design services and IP solutions, Faraday assists customers with a variety of chip design projects. In response to the growing demand for multi-die designs, Faraday recently launched an advanced 2.5D/3D-IC packaging service aimed at improving product performance and reducing power consumption. This type of design requires advanced multiphysics analysis tools to ensure the signal integrity, structural integrity, and power distribution are reliable before fabrication, especially as chips become denser and more susceptible to electromagnetic (EM) issues.

By integrating RaptorX into its design flow, Faraday will improve precision and efficiency in its development process. The tool enables accurate EM modeling and analysis for advanced 3D-IC products, ensuring that data transfer meets the latest standards. This enhances the overall design fidelity, improves performance and reliability, and accelerates time-to-market.

C.H. Chien, Vice President of R&D at Faraday, emphasized the importance of early-stage design accuracy:
“Our extensive silicon IP allows customers to start their designs from a strong foundation, focusing on innovation and market differentiation. Since fabrication is costly with no room for error, keeping project costs low begins with accurate initial design. With RaptorX integrated into the process, we can offer an efficient workflow that includes design verification and signoff, plus access to top-tier testing and fabrication services, ensuring chip performance and longevity.”

John Lee, Vice President and General Manager of the Semiconductor, Electronics, and Optics Business Unit at Ansys, added:
“Ansys’ multiphysics platforms help companies like Faraday address the critical challenges of 3D-IC development and accelerate their time-to-market. Our advanced tools allow for detailed modeling and analysis of electromagnetic phenomena, keeping customers at the forefront of advancements in 5G, AI, and IoT.”

This collaboration between Faraday and Ansys will support the development of more robust and reliable multi-die designs, allowing Faraday’s customers to confidently bring innovative products to the market faster.