Infineon Technologies Unveils HybridPACK Drive G2 Fusion: A New Standard in Power Modules for E-Mobility

In a move to make electric mobility more accessible, Infineon Technologies AG has introduced the HybridPACK Drive G2 Fusion, a new power module designed specifically for traction inverters in e-mobility applications. This innovative module sets a new standard by combining silicon (Si) and silicon carbide (SiC) technologies, offering an optimal blend of performance, efficiency, and affordability. With this breakthrough, Infineon aims to provide automakers and system suppliers with greater flexibility in designing high-performance, cost-effective electric vehicle (EV) inverters.

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A Smart Combination of Silicon and Silicon Carbide Technologies

One of the key innovations in the HybridPACK Drive G2 Fusion module is its ability to balance cost and efficiency by utilizing both silicon and SiC components. While SiC technology offers superior performance in terms of thermal conductivity, breakdown voltage, and switching speed, it is also more expensive than traditional silicon-based modules.

This hybrid approach allows system suppliers to reduce the overall amount of SiC used in each vehicle, without sacrificing performance. With 30% SiC and 70% silicon, the HybridPACK Drive G2 Fusion achieves nearly the same efficiency as a full SiC-based inverter, but at a much lower cost.

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Infineon’s Leadership in Automotive Semiconductor Innovation

“The HybridPACK Drive G2 Fusion represents Infineon’s continued leadership in automotive semiconductors,” said Negar Soufi-Amlashi, Senior Vice President and General Manager of High Voltage at Infineon’s Automotive division. “As the demand for greater driving range in electric vehicles grows, this solution provides an ideal blend of performance and cost-effectiveness. It integrates seamlessly into existing systems, offering a compelling alternative to full SiC solutions without adding complexity for system suppliers and vehicle manufacturers.”

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Seamless Integration and High Performance

The HybridPACK Drive G2 Fusion extends Infineon’s HybridPACK Drive portfolio by offering a plug-and-play solution that can be quickly incorporated into automotive systems. Its design eliminates the need for complex reconfigurations when migrating from fully silicon-based or SiC-based modules to the new hybrid module.

The HybridPACK Drive G2 Fusion module offers:

• Up to 220 kW power output in the 750 V class.
• Operating temperature range from -40°C to +175°C, ensuring reliability in extreme environments.
• Improved thermal conductivity for enhanced performance.

This hybrid power module leverages Infineon’s CoolSiC technology alongside silicon IGBT EDT3 technology, both of which enable fast switching and high efficiency. Additionally, the design allows for the use of either single or dual gate drivers, making it easy for manufacturers to transition from traditional silicon or SiC inverters to the hybrid solution.

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Cost Savings Without Compromising on Quality

Infineon’s expertise in power module packaging and semiconductor technology plays a crucial role in delivering premium performance while maintaining cost-efficiency. The HybridPACK Drive G2 Fusion module integrates features such as:

• Swoboda or XENSIV Hall sensors for precise and efficient motor control.
• Advanced MOSFET and IGBT technologies that contribute to system-level cost savings.

This integration reduces the need for external components and optimizes system performance, resulting in a highly reliable, scalable power module for automotive applications.

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Conclusion

Infineon’s HybridPACK Drive G2 Fusion module offers a revolutionary solution for the e-mobility industry by combining the best attributes of silicon and silicon carbide technologies. It provides automakers and system suppliers with the flexibility to design high-performance inverters at a reduced cost, supporting the growing demand for more affordable and efficient electric vehicles.

With its plug-and-play integration, improved thermal management, and modular design, the HybridPACK Drive G2 Fusion sets a new standard in power modules for electric mobility. By making advanced technology more accessible, Infineon is helping drive the adoption of sustainable transportation solutions worldwide.

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FAQs

1. What makes the HybridPACK Drive G2 Fusion unique?
The module’s hybrid design combines 30% silicon carbide (SiC) with 70% silicon, achieving nearly the same efficiency as a full SiC solution but at a lower cost.

2. What power output does the module offer?
The HybridPACK Drive G2 Fusion provides up to 220 kW in the 750 V class, making it suitable for a range of electric vehicle applications.

3. How does the module improve thermal management?
The module leverages Infineon’s CoolSiC technology to enhance thermal conductivity, ensuring reliable performance across a wide temperature range.

4. Can the module be easily integrated into existing systems?
Yes, the HybridPACK Drive G2 Fusion offers plug-and-play compatibility and supports both single and dual gate drivers, enabling quick integration without major design changes.

5. What sensors are integrated into the HybridPACK Drive G2 Fusion?
The module incorporates Swoboda or XENSIV Hall sensors for accurate motor control, further enhancing system efficiency.