OMNIVISION Unveils OX12A10 12MP CMOS Image Sensor with TheiaCel Technology at AutoSens Europe 2024
The OX12A10 sensor, offering 12MP resolution, is the highest-resolution device in OMNIVISION’s 2.1-micron (µm) TheiaCel
OMNIVISION, a global leader in semiconductor solutions specializing in advanced digital imaging, analog, and touch & display technologies, has introduced its OX12A10 12-megapixel (MP) CMOS image sensor featuring TheiaCel technology at AutoSens Europe 2024. This new sensor enhances automotive safety by delivering superior resolution and image quality under all lighting conditions, making it ideal for high-performance front machine vision cameras used in Advanced Driver Assistance Systems (ADAS) and autonomous driving (AD) applications.
The OX12A10 sensor, offering 12MP resolution, is the highest-resolution device in OMNIVISION’s 2.1-micron (µm) TheiaCel product line, which also includes the 8MP OX08D10 and 5MP OX05D10 sensors. The TheiaCel technology utilizes next-generation lateral overflow integration capacitors (LOFIC) and OMNIVISION’s dual conversion gain (DCG) high dynamic range (HDR) technology to eliminate LED flicker and ensure consistent image quality across various lighting environments. TheiaCel also provides a broader dynamic range compared to earlier automotive HDR systems.
Dr. Paul Wu, head of automotive product marketing at OMNIVISION, commented, “Our sensing solutions are designed to enhance driving safety and autonomy. The OX12A10 combines high resolution, excellent low-light performance, LED flicker mitigation (LFM), compact size, power efficiency, and superior high-temperature performance in one device. TheiaCel technology, introduced at AutoSens last year, has generated significant interest, and we’re excited to expand the family with the first high-performance 12MP sensor for the automotive industry. Our 5MP and 8MP solutions cater to mainstream vehicles, while the OX12A10 targets next-gen ADAS and AD vision systems.”
With a 1/1.43-inch optical format, the OX12A10 is the first sensor to feature OMNIVISION’s a-CSP+ package technology. Its compact design, measuring just 12450µm x 8100µm, is more space-efficient than traditional ball grid array (BGA) packages.
The OX12A10 is available for sampling now, with mass production scheduled for Q3 2025. For further details, visit OMNIVISION’s booth at AutoSens Europe 2024, Booth 300, from October 8-10, 2024, in Barcelona, Spain, or contact an OMNIVISION sales representative at www.ovt.com/contact-sales.