World’s Smallest MCU: Texas Instruments Revolutionizing Compact Designs

World’s smallest MCU: Texas Instruments (TI) has introduced the world’s smallest MCU (microcontroller unit), further expanding its robust portfolio of Arm® Cortex®-M0+ MSPM0 MCUs. Measuring just 1.38mm² , roughly the size of a black pepper flake, the new MSPM0C1104 MCU is housed in a wafer chip-scale package (WCSP). This groundbreaking innovation allows designers to optimize board space without compromising performance, making it ideal for compact applications like medical wearables, personal electronics, and other space-constrained devices.

Unlocking Innovation in Tiny Systems

“Board space is a scarce and valuable resource in tiny systems such as earbuds and medical probes,” said Vinay Agarwal, Vice President and General Manager of MSP Microcontrollers at TI. “With the addition of the world’s smallest MCU, our MSPM0 MCU portfolio opens up unlimited possibilities to enable smarter, more connected experiences in everyday life.”

The MSPM0C1104 MCU leverages advanced WCSP technology, offering a 38% reduction in size compared to competing devices. This compact design integrates essential features, including:

• 16KB of memory for efficient data processing.
• A 12-bit analog-to-digital converter (ADC) with three channels for high-precision sensing.
• Six general-purpose input/output (GPIO) pins for versatile connectivity.
• Compatibility with standard communication interfaces such as UART, SPI, and I2C.

By embedding accurate, high-speed analog components into the world’s smallest MCU, engineers can maintain computing performance while minimizing board size—a critical advantage in shrinking product designs.

Scalability Across Applications

The MSPM0C1104 joins TI’s comprehensive MSPM0 MCU portfolio , which provides scalable configurations of on-chip analog peripherals and computing options tailored to diverse applications. These include personal electronics, industrial systems, and automotive solutions. The portfolio offers pin-to-pin compatibility and flexible feature sets, enabling seamless scaling from small to large designs.

Starting at just $0.16 per unit in 1,000-unit quantities, the MSPM0 MCU portfolio also includes other compact packages designed to reduce both board size and bill-of-materials costs. This optimization empowers engineers to create products of any size while reducing system complexity and cost.

Accelerating Development with an Extensive Ecosystem

To support developers, TI provides a comprehensive ecosystem that simplifies design and accelerates time-to-market. Key resources include:

• An optimized software development kit (SDK) for all MSPM0 MCUs.
• A hardware development kit for rapid prototyping.
• Reference designs and subsystems, offering code examples for common MCU functions.
• Zero Code Studio , a tool that enables users to configure, develop, and run MCU applications in minutes—without writing code.

This ecosystem allows engineers to scale designs and reuse code across projects, minimizing hardware and software modifications. Additionally, TI’s growing investments in internal manufacturing capacity ensure reliable support for future demand.

Showcasing Innovation at Embedded World 2025

TI will showcase its latest advancements at Embedded World 2025 , held from March 11–13 in Nuremberg, Germany. Visitors to Hall 3A, Booth No. 131 can explore how TI’s technologies are reimagining embedded systems to create a smarter, more connected world. Highlights include:

• Edge AI and real-time monitoring : Demonstrations of perception and decision-making capabilities powered by edge artificial intelligence.
• IoT connectivity : Solutions for building robust Internet of Things networks.
• Open-source software development : Tools and platforms for streamlined coding and prototyping.

Key presentations during the event include:

• March 11 : TI Chief Technology Officer Ahmad Bahai discusses “C-Level @ Embedded World.”
  
• March 12 : Daolin Qiu presents “Time Synchronization over Network Redundancy in Real-Time Applications.”
  
• March 13 : Nilabh Anand explores “Audio Solutions with TSN – Architecture for Zonal Automotive ECUs”.

Availability and Pricing

Preproduction quantities of the MSPM0C1104 MCU are now available on TI.com. Priced at $0.20 per unit in 1,000-unit quantities, the WCSP device offers exceptional value for its size and performance 3. Additionally, the MSPM0C1104 LaunchPad Development Kit is available for $5.99 , providing an affordable platform for rapid prototyping and testing.

Conclusion

With the launch of the world’s smallest MCU, Texas Instruments continues to lead the way in compact, high-performance embedded solutions. By combining innovative packaging technology, scalable features, and a robust development ecosystem, TI empowers engineers to push the boundaries of what’s possible in compact designs. Whether you’re developing medical wearables, personal electronics, or industrial systems, the MSPM0C1104 MCU offers unmatched flexibility and efficiency to meet the demands of modern applications.

For more information, visit TI.com.

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