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Vishay Intertechnology Launches High-Energy PTC Thermistors for Automotive and Industrial Applications

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Vishay Intertechnology, Inc. has introduced the PTCEL High Energy series, a new line of inrush current limiting positive temperature coefficient (PTC) thermistors. These thermistors are designed to enhance performance in active charge and discharge circuits for automotive and industrial applications by delivering exceptional energy handling, reliability, and voltage capabilities. The PTCEL High Energy series supports up to 340 J of energy handling at 25 °C—five times higher than other devices at elevated temperatures—offering enhanced protection and efficiency in high-performance environments.

Broad Resistance Range and High Voltage Performance

The newly launched thermistors feature R25 resistance values ranging from 150 Ω to 1.5 kΩ, paired with high maximum voltage ratings of up to 1200 VDC. They are engineered to operate efficiently at elevated temperatures, handling 180 J at 85 °C and 130 J at 105 °C. Their superior energy handling allows circuit designers to reduce the number of components required, saving space and lowering costs. With an operational range up to +105 °C and a heat capacity of 2.6 J/K across all resistance values, the PTCEL High Energy series offers reliable high-temperature performance.

AEC-Q200 Qualified for Versatile Applications

These thermistors are AEC-Q200 qualified, ensuring durability and self-protection in applications where current limiting and overload protection are essential. Their reliability makes them ideal for AC/DC and DC/DC converters, DC-Link, battery management, emergency discharge circuits, on-board chargers, home energy storage, heat pumps, motor drives, and welding equipment. Withstanding over 100,000 inrush cycles and resilient against peak non-switching power up to 25 kW, the PTCEL High Energy series is built to support long-term, high-stress applications.

Robust Design and Flexible Packaging Options

Built with barium titanate, these thermistors consist of a ceramic pellet enclosed between two tinned CCS wires and coated with UL 94 V-0 compliant high-temperature silicone lacquer. The devices are RoHS-compliant and compatible with automated handling equipment, thanks to their availability in tape-on-reel packaging. Vishay offers options for leadwire pitch in 5.0 mm, 7.5 mm, and 10 mm configurations, allowing flexibility in design integration. SPICE and 3D models are also available for efficient design simulations.

PTCEL High Energy Series Specifications

Part NumberR25 (Ω)R25 Tolerance (%)Max AC Voltage (VRMS)Max DC Voltage (VDC)Max Energy (J) @ 25 °CHeat Capacity (J/K)Lead Pitch (mm)
PTCEL67R150 to 150030460 to 800650 to 12003402.65.0, 7.5, 10.0

Availability

Samples and production quantities of Vishay’s PTCEL High Energy series thermistors are available with a lead time of 10 weeks, providing designers with access to high-performance components for demanding applications.

element14 Launches LattePanda Mu Compute Module, Carrier Boards, and Starter Kit by DF Robot

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element14 has announced the availability of the LattePanda Mu compute module, along with its carrier boards and starter kit—new additions to DF Robot’s popular LattePanda series. These products are now in stock and available for purchase.

Powerful and Compact: LattePanda Mu Compute Module

The LattePanda Mu is a compact x86 compute module powered by an Intel N100 quad-core processor, capable of reaching a turbo frequency of 3.4GHz. This processor configuration provides reliable performance and supports multitasking across a range of applications, making the module well-suited for various demanding tasks. Designed with flexibility in mind, LattePanda Mu supports multiple operating systems, including Windows 10, Windows 11, Linux, and more, allowing for extensive customization and versatility.

With its pocket-sized form, the LattePanda Mu module can be seamlessly integrated into space-limited environments, delivering robust computational power without taking up unnecessary room.

Advancing the LattePanda Legacy

Romain Soreau, Global Program Manager for Single Board Computing at element14, highlighted that the LattePanda Mu builds on the established reputation of the LattePanda line as a complete single-board computer (SBC). “LattePanda Mu can handle everything a traditional PC can, including powerful software like Visual Studio, NodeJS, Java, Processing, and more. This compute module, alongside the carrier boards and starter kit, offers an appealing mix of speed, power, and flexibility.”

Customizable Carrier Board for Specialized Applications

The LattePanda Mu module enables users to tailor their designs with custom interfaces and form factors in the carrier board, making it ideal for either energy-saving applications or high-performance setups, such as a 10GbE network-ready NAS. The N100 processor further enhances this adaptability by delivering excellent processing and encryption/decryption capabilities, allowing the use of multiple network cards to support complex networking needs.

Joy Yang, Business Development Manager at DFRobot, noted the advantages of LattePanda Mu’s open-source carrier board files and flexible port options, stating that they allow users to easily create customized carrier boards to meet unique requirements. “The LattePanda Mu has been an incredibly popular addition for DFRobot, and we are excited to see it become a success with element14’s customers as well.”

Global Availability

The LattePanda Mu compute module, along with the carrier boards and starter kit, is now shipping worldwide through element14’s network: Farnell in EMEA, Newark in North America, and element14 in APAC.

Infineon Technologies Achieves Breakthrough with 20-Micrometer Ultra-Thin Silicon Wafers for Power Semiconductors

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Following the introduction of the world’s first 300-millimeter gallium nitride (GaN) power wafer and the opening of the largest 200-millimeter silicon carbide (SiC) power fabrication plant in Kulim, Malaysia, Infineon Technologies AG has reached another significant milestone in semiconductor innovation. The company has successfully developed and processed ultra-thin silicon power wafers, measuring only 20 micrometers thick with a 300-millimeter diameter, in a large-scale semiconductor fab. To put this in perspective, these wafers are a quarter as thick as a human hair and only half the thickness of current high-performance wafers, which range between 40-60 micrometers.

Revolutionary Ultra-Thin Wafers for Energy-Efficient Power Systems

“This achievement demonstrates our commitment to delivering exceptional customer value by advancing the limits of power semiconductor technology,” said Jochen Hanebeck, CEO of Infineon Technologies. “With this breakthrough in ultra-thin wafer technology, we are paving the way for more efficient energy solutions while accelerating progress in key global trends like decarbonization and digitalization. This innovation reinforces our leadership position in the semiconductor industry, as we have mastered all three key materials: silicon (Si), silicon carbide (SiC), and gallium nitride (GaN).”

This new generation of ultra-thin silicon wafers offers substantial improvements in power density, energy efficiency, and system reliability. These benefits are critical for a variety of applications, including AI-driven data centers, motor control systems, and consumer electronics. By reducing the wafer’s thickness, Infineon has lowered substrate resistance by 50%, which in turn decreases power losses by more than 15% compared to conventional silicon wafers. This advancement is particularly valuable for high-end AI servers, which operate at increasing current levels and demand efficient voltage regulation.

In these advanced server applications, power conversion systems must step down voltages from 230 volts to below 1.8 volts for optimal processor operation. Infineon’s ultra-thin wafer technology supports a vertical power delivery design based on trench MOSFET technology. This configuration ensures a close connection between the AI processor and the power delivery system, minimizing power losses and enhancing overall efficiency.

A Game-Changer for AI Data Centers and the Future of Energy Management

Adam White, Division President of Power & Sensor Systems at Infineon, emphasized the importance of energy-efficient solutions for AI infrastructure. “As the demand for AI servers and data centers continues to rise, energy efficiency becomes a top priority. Our ultra-thin wafer technology aligns perfectly with our goal of powering AI systems—from the grid to the processor core—with maximum efficiency,” White stated. “This is a growing market for us, with double-digit growth rates expected. We anticipate our AI-focused business to generate one billion euros in revenue within the next two years.”

Overcoming Technical Challenges in Ultra-Thin Wafer Manufacturing

Achieving a wafer thickness of just 20 micrometers posed significant engineering challenges, requiring Infineon to develop an innovative wafer grinding process. One of the main difficulties arose from the metal layers supporting the chip on the wafer, which are thicker than the wafer itself. This presented challenges in handling, grinding, and processing the wafer’s backside. Additional complications, such as wafer bowing and separation, required precise engineering solutions to maintain stability during assembly and ensure the structural integrity of the wafer.

Building on its existing expertise, Infineon successfully integrated the 20-micrometer wafer technology into its high-volume silicon production lines without adding unnecessary complexity to the manufacturing process. This seamless integration not only ensures high yields but also maintains supply chain security, reflecting Infineon’s commitment to reliable and scalable semiconductor production.

Early Customer Adoption and Future Applications

Infineon’s ultra-thin silicon wafer technology has already been qualified and integrated into its Integrated Smart Power Stages (DC-DC converters), with initial deliveries made to select customers. These power converters highlight Infineon’s ongoing leadership in the semiconductor industry and showcase the company’s extensive patent portfolio around this cutting-edge technology.

The rollout of ultra-thin wafers is expected to accelerate over the next three to four years, gradually replacing conventional wafer technology in low-voltage power converters. This shift will strengthen Infineon’s unique position in the market, leveraging the broadest portfolio of semiconductor products built on silicon, SiC, and GaN technologies. All three materials are essential for advancing decarbonization and digitalization efforts, which are key drivers of future innovation.

Conclusion: Infineon Solidifies Its Leadership in Power Semiconductor Innovation

With the development of 20-micrometer ultra-thin silicon wafers, Infineon Technologies has achieved a groundbreaking advancement in power semiconductor manufacturing. The innovation not only reduces power loss and improves energy efficiency but also aligns with the company’s long-term goals of enabling sustainable energy solutions. This achievement reinforces Infineon’s role as a leader in semiconductor technology and positions the company to meet the growing demands of AI data centers, consumer electronics, and industrial power systems.

FAQs

1. What makes Infineon’s ultra-thin wafers unique?
Infineon’s 20-micrometer wafers are the thinnest silicon wafers ever produced on a large scale. They offer a significant reduction in substrate resistance, lowering power loss by more than 15% compared to conventional wafers.

2. How will the new wafers benefit AI data centers?
The ultra-thin wafers enable more efficient voltage regulation and power delivery to AI processors, helping data centers reduce power loss and improve energy efficiency as energy demands increase.

3. What challenges did Infineon overcome in producing these wafers?
The manufacturing process required innovative grinding techniques to handle the delicate 20-micrometer wafers. Engineers also had to address issues related to wafer bowing and backside processing to ensure stability during assembly.

4. How does this technology fit into Infineon’s overall product portfolio?
Infineon’s ultra-thin wafers complement its extensive product lineup, which includes silicon, SiC, and GaN-based devices. These technologies are crucial for enabling energy-efficient solutions across multiple industries.

5. When will the ultra-thin wafer technology replace conventional wafers?
Infineon expects the transition from traditional wafer technology to ultra-thin wafers to take place over the next three to four years, particularly in low-voltage power converter applications.

Magnachip Semiconductor Expands Production of 7th Generation MXT LV MOSFETs

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Magnachip Semiconductor Corporation has announced a significant expansion in the production of its 7th generation MXT LV MOSFETs, powered by the company’s advanced Super Short Channel FET (SSCFET) technology. This move aligns with the increasing demand for compact low-voltage MOSFETs with reduced RSS(on) resistance, which plays a key role in enhancing mobile device efficiency.

Cutting-Edge Technology for Enhanced Battery Performance

As smartphones and other mobile devices become more sophisticated, the need for components that ensure greater efficiency, lower power loss, and improved battery life has risen. Magnachip’s MXT LV MOSFET series addresses these requirements by offering extremely low RSS(on) values, made possible through the integration of SSCFET technology. This technology minimizes the channel length between the source and drain in the on-state, resulting in lower energy consumption, better battery performance, and reduced thermal output, which prevents overheating.

Innovative Packaging for Design Flexibility

The new MXT LV MOSFETs are manufactured using wafer-level chip scale packaging (WLCSP) with a thickness of just 100µm. This ultra-thin design offers manufacturers more flexibility when creating compact, high-performance mobile devices. These MOSFETs are ideal for various consumer electronics, including smartphones, smartwatches, wireless earbuds, and innovative ring-shaped devices.

Adoption in Premium Smartphones and High-Volume Models

Magnachip has strengthened its position in the mobile market by supplying its MXT LV MOSFETs to a leading global smartphone manufacturer. The MDWC0151ERH model, one of the flagship MOSFETs from this series, has been adopted for use in the brand’s premium smartphone line. Additionally, the MDWC12D025ERH is now incorporated into the company’s popular midrange smartphone models, demonstrating the versatility and scalability of these components.

During the first three quarters of 2024, the production of MXT LV MOSFETs saw a 120% increase compared to the same period in 2023, reflecting the growing market demand for energy-efficient semiconductor solutions.

CEO Remarks on Strategic Growth and Innovation

YJ Kim, CEO of Magnachip Semiconductor, emphasized the company’s commitment to ongoing innovation and collaboration. “Our close partnership with a major global smartphone manufacturer has allowed us to bring high-quality products to the market. We aim to further expand our MXT LV MOSFET portfolio and explore additional battery-powered markets, including e-bikes, scooters, e-cigarettes, and drones.”

MXT LV MOSFET Series Overview

The MXT LV MOSFET family is designed to deliver outstanding performance in applications requiring 12V to 40V trench MOSFETs. Below is a summary of the product lineup:

ProductVSS [V]RSS(on) [mΩ] @ VGS=3.8VPackage
MDWC12D024PERH12Max: 2.4 / Typ: 1.95WLCSP
MDWC12D025ERH12Max: 2.5 / Typ: 1.95WLCSP
MDWC0151ERH24Max: 2.3 / Typ: 3.1WLCSP
MDWC22D020ERH22Max: 2.0 / Typ: 1.6WLCSP

Key Product Benefits:

  1. MXT LV MOSFET (Magnachip eXtreme Trench Low Voltage MOSFET): A high-performance product line covering 12V to 40V trench MOSFETs.
  2. RSS(on) Value: Refers to the on-resistance between two protected MOSFET sources when in operation, influencing power efficiency and thermal performance.

Looking Ahead: Expansion Beyond Mobile Devices

Magnachip’s ambition goes beyond just the smartphone sector. The company plans to leverage its expertise in low-voltage MOSFET technology to target various other battery-powered markets, such as electric bikes, e-scooters, e-cigarettes, and drones. These emerging applications require components that offer not only efficient power consumption but also compact designs to meet the growing consumer expectations.

Conclusion

Magnachip’s 7th generation MXT LV MOSFETs reflect the company’s continuous focus on technological advancement and meeting the needs of the mobile electronics market. With its innovative SSCFET technology, ultra-thin packaging, and reliable production capabilities, the company is well-positioned to grow its presence not only in premium smartphones but also in various new battery-powered markets.

For more information visit here

FAQs

1. What is the main benefit of SSCFET technology in MXT LV MOSFETs?
SSCFET technology minimizes the channel length between the source and drain during on-state operation, reducing energy consumption and improving battery efficiency.

2. How does WLCSP packaging benefit manufacturers?
The 100µm-thin WLCSP packaging allows for more design flexibility, making the MOSFETs suitable for compact devices like smartphones, smartwatches, and wireless earbuds.

3. Which smartphone models are using Magnachip’s MXT LV MOSFETs?
Magnachip’s MDWC0151ERH is integrated into a premium smartphone model, while the MDWC12D025ERH is featured in a high-volume midrange model from a leading global manufacturer.

4. What industries does Magnachip plan to target next with its MOSFET technology?
Beyond smartphones, Magnachip is focusing on battery-powered markets like e-bikes, scooters, drones, and e-cigarettes.

5. How much did Magnachip’s production of MXT LV MOSFETs grow in 2024?
In the first three quarters of 2024, production grew by approximately 120% compared to the same period in 2023, reflecting the increasing demand for their products.

STMicroelectronics Launches Advanced Bio-Sensing Chip for Next-Generation Wearables

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STMicroelectronics (ST), a global leader in semiconductors, has introduced the ST1VAFE3BX, an innovative bio-sensing chip designed for the latest healthcare wearables such as smartwatches, sports bands, connected rings, and smart glasses. This new chip integrates high-accuracy biopotential inputs with ST’s inertial sensing and AI-powered capabilities to deliver faster performance and reduced power consumption.

Simone Ferri, Vice President of the MEMS Sub-Group at ST, explained:
“Wearable technology has transformed personal health awareness and fitness tracking. Now, anyone can monitor heart rate, physical activity, and location data directly from their wrist. Our latest biosensor takes this a step further, combining motion detection and body signal monitoring in a compact, energy-efficient design.”

Opportunities for Wearable Innovation Beyond the Wrist

Analysts at Yole Development predict significant growth in wearables, with consumer healthcare devices expanding into regulated medical products available over-the-counter. The ST1VAFE3BX offers manufacturers the ability to integrate advanced features like heart-rate variability, mental health tracking, and cognitive performance monitoring.

The versatility of this biosensor allows it to be used not just in wrist-based devices but also in wearable patches designed for lifestyle monitoring or clinical applications. Early adopters, including BM Innovations GmbH (BMI) and Pison, have already integrated the sensor into their latest product developments.

Richard Mayerhofer, Managing Director of BMI, noted:
“ST’s biosensor enabled us to create a new generation of athlete performance monitoring solutions, including ECG-enabled chest bands and small wearable patches. By combining analog biopotential signals with motion data in a compact package, it allows for context-aware analysis. Support for AI algorithms within the chip aligns perfectly with the needs of our advanced monitoring systems.”

David Cipoletta, CTO of Pison, added:
“ST’s biosensor has greatly improved our ability to enhance the user experience of wearable devices. It enables gesture recognition, monitors cognitive performance, and supports applications focused on neurological health.”

Compact, Power-Efficient Design for Enhanced Wearables

The ST1VAFE3BX chip is designed to fit into compact wearable devices, featuring a 2mm x 2mm 12-lead LGA package. It integrates an analog front end (vAFE) that simplifies the detection of biopotential signals, such as heart or brain activity, even when sensors are affected by skin conditions or electrode placement.

Manufacturers can use the ST1VAFE3BX for applications like:

  • ECG (electrocardiography)
  • EEG (electroencephalography)
  • SCG (seismocardiography)
  • ENG (electroneurography)

These features allow device makers to develop affordable, user-friendly health monitoring products that provide reliable insight into the user’s physical and emotional well-being.

Leveraging AI and Inertial Sensing for Smarter Wearables

Building on ST’s expertise in MEMS technology, the ST1VAFE3BX integrates an accelerometer to track the user’s movement. By synchronizing inertial data with biopotential measurements, the chip helps wearable devices understand the relationship between physical activity and vital signs more effectively.

The chip also features AI capabilities, including a machine-learning core (MLC) and a finite state machine (FSM). These components allow product designers to implement neural processing on the chip, enabling it to autonomously perform activity detection without relying on the host CPU. This not only accelerates system response times but also reduces power consumption, allowing smart devices to operate longer between charges.

ST offers software tools through its MEMS Studio, part of the ST Edge AI Suite, to help designers optimize the chip’s performance and build custom decision trees for the MLC.

Technical Specifications of the ST1VAFE3BX

  • Analog Front End (vAFE): Programmable gain and 12-bit ADC resolution for precise biopotential measurements.
  • Maximum Data Rate: Up to 3200Hz, supporting diverse physiological measurements.
  • Power Supply Range: Operates between 1.62V to 3.6V with a typical current of 50µA and a low-power mode consuming just 2.2µA.
  • Accelerometer: Programmable full-scale range from ±2g to ±16g for accurate movement detection.
  • AI Functionality: On-chip MLC and FSM enable advanced features such as step counting, pedometer, and activity detection.

Availability and Pricing

The ST1VAFE3BX is currently in production and available for purchase through ST’s eStore and authorized distributors. Free samples are also offered to customers, with bulk orders starting at $1.50 per unit for 1,000 units.

Demonstration at Electronica 2024

Visitors to Electronica 2024 in Munich, from November 12 to 15, can experience live demonstrations of the ST1VAFE3BX at ST’s booth in Hall C3, Stand 101. Attendees will have the opportunity to explore its full potential for wearable applications and learn more about how the chip is driving innovation in healthcare technology.

Conclusion

With the launch of the ST1VAFE3BX, STMicroelectronics is advancing the capabilities of health and fitness wearables, providing manufacturers with a powerful tool to create smarter, more efficient devices. Thanks to AI integration, inertial sensing, and a compact, energy-efficient design, this biosensor opens new possibilities for health monitoring, cognitive tracking, and wellness applications, supporting the growing trend of personalized healthcare.

For more information, visit the official ST website at www.st.com/biosensors.

AAEON and UGUARD NETWORKS Partner to Deliver Advanced Cybersecurity and Networking Solutions

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AAEON, a leader in embedded systems and AI technologies, has announced a strategic partnership with UGUARD NETWORKS, a prominent provider of cybersecurity and networking solutions. This collaboration brings together AAEON’s cutting-edge network computing platforms with UGUARD’s software expertise, with the goal of delivering scalable and easily deployable WAN and cybersecurity solutions to meet the needs of diverse organizations.

Ensuring Compatibility Through Rigorous Testing

As part of their joint efforts, both companies conducted extensive testing to ensure seamless compatibility between AAEON’s FWS-7541 and FWS-7840 rackmount network appliances and UGUARD’s proprietary software. The certification process involved performance and security evaluations that assessed how effectively the devices manage high data traffic and respond to simulated large-scale cyberattacks.

UGUARD confirmed the reliable performance of AAEON’s hardware, highlighting the FWS-7541 for its strong network management capabilities under heavy workloads and the FWS-7840 for its ability to offer real-time, effective network protection. Both appliances met the rigorous standards required for enterprise-level security during the certification process.

Strengthening Global Network Security

The partnership with UGUARD will enable AAEON to expand the application of its products in various network security domains, including global threat intelligence, next-generation firewalls (NGFW), and unified threat management (UTM). By integrating AAEON’s hardware with UGUARD’s software solutions, the collaboration aims to enhance product credibility and offer organizations more robust network protection.

Howard Lin, CEO of AAEON, stated:
“This certification reflects our commitment to delivering world-class network platforms that address the unique needs of enterprises. UGUARD’s innovative approach to the evolving landscape of network security aligns perfectly with AAEON’s commitment to providing flexible and adaptable solutions for our customers.”

Jason Yen, CEO of UGUARD NETWORKS, added:
“As cybersecurity challenges continue to grow globally, UGUARD and AAEON have partnered to deliver real-time threat intelligence and robust network solutions. Together, we aim to strengthen data privacy, enhance cybersecurity defenses, and improve the resilience of global networks.”

A Future-Focused Collaboration

This partnership reinforces the two companies’ shared goal of delivering innovative, future-ready network security solutions. With UGUARD’s certification and ongoing technical collaboration, AAEON’s products are well-positioned to meet the increasing demands of network security for enterprises around the world.

Learn More

For additional details on AAEON’s Rackmount Network Appliances, please visit the AAEON website. To explore UGUARD NETWORKS’ cybersecurity services, visit their official website.

Power Management Integrated Circuit (PMIC) Market: A Rapidly Evolving Landscape

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The Power Management Integrated Circuit (PMIC) market is experiencing significant growth driven by increasing demand for energy-efficient solutions across multiple industries, including consumer electronics, automotive, telecommunications, and industrial sectors. With rising global energy needs, coupled with technological advancements, Power Management Integrated Circuit have become essential for efficient power regulation, distribution, and management in modern electronic devices. Forecasts suggest that the PMIC market will continue its upward trend, with global demand projected to grow significantly by 2031, fueled by investments in renewable energy, regulatory initiatives, and ongoing technological innovation.

Key Drivers of Power Management Integrated Circuit Market Growth

  1. Growing Focus on Energy Efficiency in Electronics
    Consumers and industries are prioritizing energy-efficient devices that can minimize power consumption without sacrificing performance. PMICs play a critical role in regulating voltage, managing power flow, and optimizing battery usage in products such as smartphones, tablets, automotive systems, and industrial equipment. Their ability to provide precise control over energy consumption makes them indispensable in devices where performance consistency and energy conservation are crucial.
  2. Increased Adoption in Electric Vehicles (EVs)

    The growing transition toward electric vehicles (EVs) has significantly increased the demand for PMICs. These circuits are essential for battery management systems, ensuring efficient power distribution, temperature regulation, and battery safety. With major investments from automotive companies in EV development, the use of PMICs in EVs is set to grow steadily. Furthermore, the rising adoption of autonomous driving technology will require more PMICs for managing power in ADAS systems, sensors, and in-car infotainment, further driving market expansion.
  3. 5G and IoT Infrastructure Growth

    The proliferation of 5G networks and IoT devices has amplified the need for PMICs to manage the power demands of high-performance networking equipment and battery-operated IoT devices. Smart homes, industrial automation, and telecommunication networks all rely on low-power, efficient energy management for smooth operation. PMICs enable extended battery life and optimized energy consumption, which are essential for IoT devices deployed in remote environments.
  4. Advances in Semiconductor Technology

    Technological progress in the semiconductor industry has enabled the creation of more advanced Power Management Integrated Circuit with multiple integrated functions. These PMICs offer features such as voltage regulation, power conversion, and battery management in a compact design, reducing circuit complexity and production costs. This evolution makes PMICs more versatile and cost-effective, broadening their application in a variety of industries.

Market Segmentation Overview

The PMIC market is categorized by product type, application, and geographical region, with each segment contributing to the market’s projected growth through 2031.

  • By Product Type: Key products include voltage regulators, battery management ICs, LED drivers, and motor control ICs. Among these, battery management ICs and voltage regulators dominate the market, driven by growing demand for portable electronics and electric vehicles.
  • By Application: The PMICs are used across multiple sectors, including consumer electronics, automotive, telecommunications, and industrial automation. While consumer electronics has traditionally led the market, the automotive sector is emerging as a high-growth area due to the widespread adoption of electric and autonomous vehicles.
  • By Region: The market is geographically segmented into Asia Pacific, North America, Europe, and Latin America. The Asia Pacific region is expected to lead the market due to the presence of major consumer electronics and automotive manufacturers in countries like China, Japan, and South Korea. North America and Europe are also key markets, driven by technological advancements and a growing emphasis on energy-efficient solutions.

Technological Trends Shaping the Future of PMICs

  1. AI-Driven Power Management

    The integration of machine learning and artificial intelligence into PMICs allows for predictive power management. These advanced circuits can analyze user behavior and environmental data to anticipate power needs, optimizing energy consumption in real time.
  2. Emerging Use of Gallium Nitride (GaN) and Silicon Carbide (SiC)

    GaN and SiC materials are increasingly used in PMICs due to their high power density, improved thermal conductivity, and lower switching losses compared to traditional silicon-based components. These materials are ideal for high-power applications such as electric vehicles, industrial motors, and fast-charging systems.
  3. Wireless Power and Energy Harvesting

    PMICs that support wireless power transfer and energy harvesting are gaining popularity, especially for IoT devices. These circuits efficiently manage power from ambient sources, such as solar or kinetic energy, reducing dependence on batteries and minimizing maintenance for remote devices.
  4. Miniaturization and Thermal Management Solutions

    As devices become smaller, PMICs must fit into compact spaces while maintaining high performance. Enhanced thermal management technologies are being integrated into PMICs to prevent overheating and ensure efficient operation in space-constrained environments.

Challenges and Opportunities in the Power Management Integrated Circuit Market

The Power Management Integrated Circuit market faces several challenges, including the complexity of circuit design and the need to comply with different regulatory standards across regions. Additionally, supply chain disruptions in the semiconductor industry pose risks to production and cost management. However, these challenges create opportunities for innovation. New PMIC designs are becoming more adaptable and resilient, allowing them to perform reliably in diverse environments.

The growing focus on renewable energy also presents significant growth potential for PMICs. With an increasing number of solar and wind power installations, Power Management Integrated Circuit designed for energy conversion and storage management will become essential. Collaborations between semiconductor manufacturers, energy providers, and technology companies are likely to accelerate the development of specialized PMICs for green energy applications.

Conclusion

The Power Management Integrated Circuit market is poised for substantial growth, driven by the global demand for energy-efficient solutions, the rise of electric vehicles, the expansion of 5G and IoT networks, and advancements in semiconductor technologies. Emerging trends such as AI-powered power management, the adoption of GaN and SiC materials, and wireless energy harvesting will further shape the future of the industry.

Although challenges like regulatory compliance and supply chain disruptions persist, they also present opportunities for innovation. As industries increasingly prioritize sustainability and efficiency, PMICs will play a crucial role in powering next-generation technologies and enabling a cleaner, more connected future.

These insights reflect the evolving landscape of the PMIC market, offering a glimpse into the technologies and trends that will define its future through 2031.

Image Source: google.com

Rohde & Schwarz to Showcase Advanced Test Solutions at Electronica 2024 in Munich

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The 60th edition of Electronica, the world’s leading electronics trade fair, will take place in Munich from November 12 to 15, 2024. At booth A3.307 at Messe München, Rohde & Schwarz will present a wide range of test and measurement solutions designed for developers and engineers. The showcased applications will span both day-to-day tasks—like RF verification and power electronics testing—and advanced technologies such as quantum computing, automotive radar, and non-terrestrial networks.

Ensuring Reliability in Power Electronics

Rohde & Schwarz will highlight its MXO 5 and MXO 5C oscilloscopes, designed to help engineers ensure the reliability of wide-bandgap (WBG) power systems using SiC and GaN components. The eight-channel MXO 5 oscilloscope, paired with the R&S RT-ZISO isolated probing system, offers superior sensitivity, bandwidth, dynamic range, and accuracy—making it ideal for testing next-generation power designs.

A separate demonstration will focus on multi-phase buck converters, showcasing how the MXO 5 can simplify design validation for high-speed SoCs, critical in applications requiring high currents, low voltages, and fast switching speeds.

In partnership with PE Systems GmbH, Rohde & Schwarz will also exhibit an automated double pulse tester using the rack-optimized MXO 5C oscilloscope. This setup allows engineers to fine-tune power drivers and conduct verification on power conductors and passive components.

Wideband Modulated Load Pull Testing

To assess the performance of RF frontends across varying impedances, Rohde & Schwarz will present a wideband modulated load pull solution. Using the R&S SMW200A vector signal generator, R&S RTP164 oscilloscope, and the R&S RTP-K98 software, this setup allows engineers to evaluate how RF components respond to impedance changes in real-world antenna operations.

EMI Testing with R&S EPL1000

Rohde & Schwarz will feature its R&S EPL1000 EMI test receiver, which supports fast, precise electromagnetic interference (EMI) measurements up to 30 MHz. Fully compliant with CISPR 16-1-1, the EPL1000 offers 4-channel click rate analysis, real-time spectrograms, and automated testing—making it suitable for pre-certification, certification, and conformance testing in accordance with IEC, EN, CISPR, and FCC standards.

Signal Integrity Analysis for GMSL Links

The R&S RTP oscilloscope will demonstrate signal integrity analysis for Gigabit Multimedia Serial Links (GMSL), a SerDes technology developed by Analog Devices for high-resolution video applications. By generating eye diagrams, the R&S RTP helps engineers validate and debug GMSL links, ensuring optimal signal transmission for camera and display systems.

Automotive Radar and Drivetrain Testing

The new R&S RadEsT automotive radar tester will be showcased, highlighting its ability to simulate radar targets for sensor calibration, ADAS, and production-level testing. This versatile radar simulator supports functional testing both in lab environments and on OEM production lines.

Additionally, Rohde & Schwarz will present solutions for electric drivetrain optimization. Featuring instruments such as the Zurich Instruments MFIA, MXO 5 oscilloscope, and R&S NGM power supply, these tools help OEMs and suppliers improve the efficiency of inverters, battery management systems, and other critical drivetrain components.

Non-Terrestrial Network (NTN) Testing Solutions

Rohde & Schwarz’s NTN test solutions are designed to ensure reliable communication across land, sea, and air. At Electronica, the CMX500 radio communication tester will simulate complex multi-orbit satellite environments—including LEO, MEO, GSO, and GEO constellations—covering L, S, Ku, and Ka bands.

The company will also demonstrate NB-NTN test cases using the CMW500 wideband tester, showcasing compliance with GCF/PTCRB standards and protocols tailored for NTN networks, such as Skylo.

RedCap Device Testing for 5G Networks

Rohde & Schwarz will also introduce solutions for testing 5G RedCap devices—a category of 5G devices with reduced features that operate exclusively on standalone 5G networks. With the CMX500 communication tester, visitors will learn how to ensure optimal performance, regulatory compliance, and protocol verification for 5G NR and LTE devices following 3GPP Release 17 standards.

Innovations for Quantum Computing and Particle Accelerators

In partnership with Zurich Instruments, Rohde & Schwarz will explore cutting-edge research tools for particle accelerators and quantum computing. The UHF-BOX Boxcar Averager will demonstrate how it captures integrated pulse amplitudes in real time, facilitating precise measurements in accelerator experiments. Oscilloscopes from Rohde & Schwarz will play a key role in monitoring signal behavior during experiments that require precise timing and amplitude measurements.

Comprehensive Service and Calibration

Rohde & Schwarz will also showcase its global service portfolio, including accredited calibration services, on-site support, repair services, and technical training through the R&S Technology Academy. With 24/7 support across multiple time zones, the company ensures that customers have access to expert assistance whenever needed.

Additionally, Rohde & Schwarz offers electronic manufacturing services (EMS) to other technology companies. At Electronica, visitors can learn more about the high-precision manufacturing capabilities at the company’s Memmingen and Teisnach facilities.

Conclusion

Rohde & Schwarz’s presence at Electronica 2024 will highlight the company’s diverse portfolio of test and measurement solutions—from day-to-day tasks to emerging technologies like non-terrestrial networks and quantum research. With its commitment to innovation and precision, Rohde & Schwarz continues to empower engineers and developers across industries, ensuring the reliability and efficiency of next-generation technologies.

Don’t miss the chance to explore these solutions in person at booth A3.307 from November 12-15, 2024, at the Messe München fairgrounds.

The Role of Smart Cities and IoT in Transforming Urban Transportation

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In recent years, smart cities have emerged as a leading concept in urban development, with governments worldwide leveraging advanced technologies to create more sustainable, efficient, and livable urban spaces. Central to this transformation is the integration of Internet of Things (IoT) solutions, particularly in the transportation sector, where they improve mobility, enhance safety, and optimize infrastructure. This article explores the interplay between smart cities and transportation, detailing the technologies, challenges, and future trends shaping this dynamic space.

What Are Smart Cities?

A smart city integrates IoT, data analytics, and digital connectivity to improve essential urban services, including transportation, energy, waste management, and public safety. The objective is to streamline operations, manage resources more efficiently, and enhance residents’ quality of life while minimizing environmental impact.

Evolution of Smart Cities

The concept of smart cities has evolved significantly, from early automation to advanced, data-driven decision-making frameworks. By deploying AI and machine learning, cities can now predict and respond to urban challenges, such as traffic congestion or energy demand, more effectively. This shift from isolated systems to connected, adaptive environments makes urban operations more sustainable and resilient.

Key Components of Smart Cities

  1. Infrastructure Integration: A seamless blend of physical and digital infrastructure allows for efficient data exchange, enabling urban services to operate cohesively.
  2. IoT and Sensors: Sensors installed throughout the city collect data on various parameters such as traffic flow, air quality, and energy use. Real-time monitoring enables cities to adapt quickly to changing conditions.
  3. Data Analytics: Advanced analytics platforms process vast datasets to generate actionable insights, allowing governments to make evidence-based decisions and improve service delivery.
  4. Connectivity: Reliable, high-speed networks (e.g., 5G) facilitate real-time communication between IoT devices and management systems, ensuring rapid responses to emergencies and operational changes.

The Impact of IoT on Transportation

IoT technology is transforming urban transportation, enhancing efficiency, safety, and user experience through smart, interconnected systems:

  1. Intelligent Traffic Management:
    IoT sensors and analytics platforms monitor traffic patterns in real-time to ease congestion and optimize travel times. These systems dynamically adjust signal timings and offer predictive insights, helping cities preempt traffic jams by analyzing historical data.
  2. Smart Parking Solutions:
    IoT-powered parking systems reduce congestion by providing real-time information on available parking spaces. Drivers can access parking availability via mobile apps or signage, reducing the time spent searching for parking and minimizing traffic buildup.
  3. Enhanced Public Transportation:
    IoT enables real-time tracking of buses, trains, and other public transit vehicles, helping transit agencies optimize routes and schedules. Predictive maintenance tools powered by IoT ensure transit vehicles remain operational, preventing service disruptions and improving reliability.

Global Innovations in Smart Mobility

Barcelona, Spain:

  • Smart Street Lighting: Motion-sensor-enabled streetlights adjust brightness based on pedestrian activity, cutting energy consumption while maintaining safety.
  • Optimized Waste Management: IoT-enabled bins track fill levels, guiding waste collection teams to reduce unnecessary trips and minimize fuel usage.
  • Public Transit Upgrades: IoT sensors on trains provide real-time data on passenger load and operational efficiency, ensuring smoother commutes.

Singapore:

  • Autonomous Vehicles (AVs): The city has piloted self-driving shuttles and taxis to reduce congestion and improve transportation efficiency.
  • Smart Logistics: IoT platforms optimize cargo movements at ports, ensuring on-time deliveries while minimizing emissions.
  • Integrated Public Transit: Contactless payment systems and IoT-based transit data improve accessibility and efficiency for commuters.

Challenges in Implementing Smart City Solutions

  1. Data Privacy and Security:
    With IoT devices collecting large amounts of data, protecting sensitive information from cyber threats is critical. Cities must implement strong cybersecurity frameworks to safeguard data and comply with privacy regulations.
  2. Infrastructure Costs:
    Building a smart city requires significant investment in IoT sensors, connectivity infrastructure, and analytics platforms. Collaboration between governments, technology providers, and financial institutions is essential to secure sustainable funding.
  3. Public Engagement:
    Gaining public trust and participation is essential for the success of smart city initiatives. Transparent communication about the benefits and risks of smart technologies helps foster public support and encourages community involvement.

Emerging Trends Shaping the Future of Smart Cities and Transportation

  1. Artificial Intelligence (AI) and Machine Learning:
    AI-powered predictive analytics will enable cities to forecast and manage urban challenges, such as traffic congestion and energy consumption, with greater precision.
  2. Sustainability and Green Technologies:
    Cities are increasingly integrating renewable energy sources, such as solar and wind power, into infrastructure. Electric vehicles (EVs) and bike-sharing programs will also play a significant role in promoting eco-friendly transportation.
  3. 5G and Advanced Connectivity:
    5G technology will enhance real-time communication between IoT devices, supporting autonomous vehicles, smart grids, and emergency response systems.
  4. Shared Mobility and Micro-mobility:
    Cities are adopting ride-sharing, car-sharing, and e-scooter services to reduce private car use. IoT platforms help manage these fleets efficiently by tracking vehicle availability and usage patterns.
  5. Digital Twin Technology:
    Digital twins—virtual models of urban environments—will enable cities to simulate infrastructure changes, test solutions, and optimize operations before implementing them in the real world.

Resilience, Sustainability, and Public Health in Smart Cities

  1. Resilient Infrastructure:
    Cities are investing in smart infrastructure that can withstand environmental challenges like flooding and heatwaves. Real-time sensors monitor infrastructure health and trigger alerts for maintenance.
  2. Green Infrastructure:
    Urban greenery, such as green roofs and parks, helps reduce the urban heat island effect. IoT sensors monitor soil conditions to optimize irrigation and conserve water.
  3. Smart Healthcare Solutions:
    Connected healthcare devices enable remote patient monitoring and telemedicine services, improving healthcare access and reducing costs.
  4. Cybersecurity Strategies:
    Cities implement robust cybersecurity frameworks to protect critical infrastructure from cyberattacks. Compliance with data protection regulations ensures that data collected from IoT systems is handled responsibly.

Community Engagement and Governance in Smart Cities

  1. Citizen Involvement:
    Cities engage residents through participatory workshops and public consultations to co-create smart city solutions tailored to community needs.
  2. Transparency and Open Data:
    Cities provide access to real-time urban data via open platforms, enabling residents to monitor infrastructure performance and participate in governance.
  3. Education and Awareness Programs:
    Public outreach campaigns and educational programs raise awareness about the benefits of smart technologies and encourage civic participation.

Conclusion

The rise of smart cities and IoT-driven transportation systems is transforming how urban environments operate, paving the way for more efficient, sustainable, and resilient cities. As connectivity, AI, and data analytics continue to evolve, cities must address challenges related to security, infrastructure investment, and public engagement to realize the full potential of these technologies. Through collaboration with residents, technology providers, and policymakers, smart cities can enhance urban living and meet future challenges head-on.

AVEVA Unveils CONNECT Platform at AVEVA Day India, Empowering Industrial Growth and Sustainability

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AVEVA, a global leader in industrial software for digital transformation and sustainability, showcased its CONNECT platform at AVEVA Day India in Mumbai. The event emphasized the critical role of industrial intelligence in helping India achieve its ambitious goal of $1 trillion in merchandise exports by 2030.

Leveraging Data for Industrial Transformation

As one of the fastest-growing economies in the world, India’s industries must embrace data, analytics, and artificial intelligence to remain competitive and capitalize on global opportunities. By breaking down data silos and harnessing the power of industrial intelligence, businesses can gain valuable insights, streamline workflows, enable real-time monitoring and control, and improve remote collaboration. These capabilities enhance the entire lifecycle of industrial assets, ensuring maximum efficiency and performance.

CONNECT: A Unified Digital Platform for Industry

The CONNECT platform empowers industrial leaders by offering AI-driven insights through a unified digital twin that consolidates data across various systems and processes. This open and neutral platform spans the entire industrial lifecycle in real time, covering everything from data management and visualization to analytics, modeling, and application development. CONNECT fosters collaboration among internal and external stakeholders, unlocking new opportunities for efficiency, sustainability, and value creation.

Built on AVEVA’s trusted software, CONNECT also integrates seamlessly with third-party applications from partners like Schneider Electric, RIB, ETAP, and others, creating a holistic industrial ecosystem.

Platform Enhancements for Greater Collaboration and Efficiency

Recent updates to the CONNECT platform have introduced new tools to support cross-functional collaboration and operational efficiency:

  • AVEVA Unified Engineering: Brings together teams across locations, disciplines, and organizations into a single digital workspace. This enables users to transition from isolated, document-based workflows to an agile, collaborative environment.
  • AVEVA Operations Control: Now included in every CONNECT subscription, this feature offers AI-powered tools to optimize production, quality, and sustainability. Businesses can quickly analyze issues, solve operational challenges, and gain actionable insights to improve performance.
  • AVEVA PI System Enhancements: These updates enable both internal and external stakeholders to access real-time data for broader use cases, increasing uptime, productivity, and cost savings across industries.

Paving the Way for India’s Industrial Growth

Ajit Kulkarni, Vice President and India Market Leader at AVEVA, highlighted the significance of the CONNECT platform in supporting India’s growth ambitions:
“India is on the brink of an industrial revolution, with the goal of becoming a global manufacturing and export powerhouse. The CONNECT platform offers companies a unique, comprehensive data ecosystem, helping them engineer smarter, operate more efficiently, and drive profitability. Through enhanced collaboration across different teams and organizations, CONNECT can accelerate India’s journey towards global success.”

Adoption Across Key Indian Sectors

AVEVA’s solutions are already being utilized by leading Indian companies across sectors such as manufacturing, energy, and infrastructure, with thousands of active users benefiting from its industrial intelligence technologies each month.

At AVEVA Day India, more than 400 attendees from various industries participated, including key players such as Adani Power, L&T Hydrocarbon, and Pimpri-Chinchwad Municipal Corporation. The event provided a platform for industry professionals to network, explore innovative technologies, and learn how digital transformation can enhance both business growth and sustainability.

Real-World Success Stories Shared at AVEVA Day

The event also featured breakout sessions, where companies from the energy, power, and manufacturing sectors shared their experiences with industrial intelligence technologies. These real-world case studies demonstrated how businesses are leveraging digital transformation not only to improve operational efficiency but also to build more sustainable, resilient organizations capable of meeting global market demands.

Conclusion

AVEVA’s CONNECT platform is set to play a crucial role in India’s industrial transformation, helping companies unlock the full potential of data and AI-driven insights. With advanced collaboration tools, real-time monitoring capabilities, and a focus on sustainability, CONNECT equips businesses to innovate, optimize operations, and contribute to India’s goal of becoming a global industrial leader.

For more information, visit www.aveva.com.

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