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Pasternack Introduces Expanded Line of Low-Loss and Low-PIM Cable Assemblies

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Pasternack, a leading provider of RF, microwave, and millimeter-wave components under the Infinite Electronics brand, has unveiled new low-loss and low-PIM (Passive Intermodulation) cable assemblies. These additions are designed to address the growing demand for enhanced signal transmission and minimal interference across various industries.

The new lineup includes a variety of LMR cable assemblies, available in PVC, fire-rated, ultra-flexible (UF), and lightweight versions. This broad selection caters to a range of applications by supporting multiple connector types, such as BNC, MCX, MMCX, N, SMA, SMB, SSMB, SSMC, and TNC.

Pasternack has also introduced low-PIM cable assemblies featuring connectors like 4.3-10 and 2.2-5, helping reduce passive intermodulation for improved signal quality in high-performance networks. These assemblies are engineered to ensure optimal signal integrity in demanding environments.

To meet diverse installation needs, the new cables come in various configurations, including straight, right-angle, standard, and reverse polarity options. Further customization is available with features like clocking and heat-shrink solutions, making the cables suitable for a wide range of environmental and operational conditions.

These cable assemblies are ideal for applications where high signal quality is essential, such as wireless communication systems, satellite networks, and outdoor installations. Pasternack offers flexible options with custom cable lengths and connectors to meet precise project requirements while maintaining excellent performance in challenging conditions.

“These low-loss and low-PIM cables are specifically designed for critical applications in wireless communications, satellite systems, and data networks,” said Amar Ganwani, Senior Product Manager at Pasternack. “They are essential for ensuring reliable and clear signal transmission.”

Pasternack’s expanded cable assembly offerings are now in stock and available for same-day shipping. For more information or assistance, contact Pasternack at +1 (949) 261-1920.

Rohde Schwarz and Skylo Technologies Achieve Key Milestone in NB-NTN Device Certification

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Rohde Schwarz, in collaboration with Skylo Technologies, has successfully validated all test cases outlined in Skylo’s network operator acceptance criteria, including newly added scenarios for SMS over NB-NTN (Narrowband Non-Terrestrial Networks). This achievement was made possible using the advanced capabilities of the CMW500 wideband radio communication tester. The accomplishment represents a significant advancement in device certification, positioning the NB-NTN technology for broader adoption.

Skylo Technologies, a global provider of non-terrestrial network (NTN) services, utilizes satellite-based communication to enable smartphone and IoT devices to connect directly via partner satellite constellations. By leveraging satellite spectrum, Skylo ensures continuous connectivity, especially in remote or underserved regions where conventional networks are unavailable. Their certification process is designed to rigorously test and evaluate devices, ensuring they meet high standards of performance and reliability.

Rohde Schwarz and Skylo Technologies Achieve Key Milestone in NB-NTN Device Certification
Rohde Schwarz and Skylo Technologies Achieve Key Milestone in NB-NTN Device Certification 2

The successful testing of SMS over NB-NTN marks an important step toward integrating satellite communication into everyday consumer devices. This breakthrough will allow smartphones, wearables, and other connected devices to maintain messaging capabilities even in areas without terrestrial network coverage, enhancing user safety and communication regardless of location.

Exploring Wave Power: A Promising Addition to Renewable Energy Solutions

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Over the past decade, renewable energy sources have made remarkable strides, with solar and wind power becoming key components of sustainable energy infrastructure. Today, these eco-friendly solutions are widely recognized, with more consumers opting for green tariffs from utility providers. Governments and organizations worldwide are actively promoting renewables, with initiatives like the United States’ goal to decarbonize its power grid by 2035. Additionally, the Department of the Interior recently surpassed its goal of developing more than 25 gigawatts of clean energy on public lands by 2025, reflecting the accelerating momentum in renewable energy adoption.

While solar and wind energy remain prominent, wave power is emerging as a reliable, untapped source with enormous potential to complement these technologies. This article explores how wave energy harnesses the kinetic motion of ocean waves, the technologies behind it, and key design considerations for building robust wave energy converters (WECs).

What Makes Wave Power Viable?

The vast, continuous motion of the world’s oceans represents an abundant source of energy waiting to be harvested. Wave power is gaining attention for its ability to generate consistent electricity with minimal environmental impact. Unlike wind and solar power, which are subject to variability, wave energy offers predictable patterns based on ocean monitoring through satellite remote sensing. This allows operators to anticipate and adjust for wave and tidal movements effectively. Additionally, well-designed wave energy systems can limit their impact on marine life and coastal areas.

Techniques for Harvesting Wave Energy

There are several ways to convert wave energy into electricity. Below are some of the most common methods used in the industry:

  • Oscillating Water Columns (OWC):
    In this approach, the rise and fall of water inside a vertical chamber compresses air, which drives a turbine generator. As waves enter and exit the chamber, the airflow generates electricity.
  • Overtopping Turbines:
    These shore-based systems capture water that flows over a raised barrier during high tides or storms. The collected water is directed through turbines to generate power, similar to barrage-style turbines used in estuaries with high tidal activity.
  • Point Absorbers:
    These systems consist of floats, flaps, or other oscillating devices anchored to the seabed. The motion of waves drives mechanical or hydraulic systems, converting kinetic energy into electricity.

CorPower Ocean: A Cutting-Edge Wave Energy Converter

An excellent example of innovation in wave energy is the CorPack from CorPower Ocean, which takes inspiration from the human heart. Designed as a point absorber, each CorPack unit resembles a navigation buoy and is anchored to the seabed. When waves push the buoy upwards, stored pressure pulls it back down, creating energy on both the upward and downward strokes.

The CorPack system incorporates several advanced technologies:

  • A wave spring that amplifies wave movement.
  • A cascade gearbox that converts the linear motion of waves into rotational energy.
  • A pre-tensioning cylinder to regulate the buoy’s position and optimize performance in varying sea conditions.

Each CorPack unit can generate up to 300kW of electricity. When deployed in clusters, these units achieve an energy density of 15 MW/km², outperforming the 7.2 MW/km² density typical of offshore wind farms. This makes CorPower Ocean’s solution an exciting contender in the renewable energy landscape.

Design Challenges for Wave Energy Systems

Developing wave energy converters (WECs) requires thoughtful consideration of the harsh marine environment. The following factors are essential to ensure reliable operation and long-term durability:

  • Environmental Considerations:
    Saltwater is highly corrosive and can degrade metals and electrical components over time. Temperature fluctuations and humidity in marine environments also increase the risk of condensation on surfaces. To protect sensitive electronics, designers should apply conformal coatings to PCBs and use enclosures with high ingress protection ratings, such as IP69K. In extreme cases, encapsulation of modules and boards can provide additional protection.
  • Mechanical Durability:
    WECs endure significant mechanical stress during both transport and installation. Throughout their operational life, they must withstand continuous wave impacts and high vibration levels. Careful design of connectors, cables, and PCB mounting is critical to prevent failures due to flexing or loosening components over time.
  • Reliability and Redundancy:
    Since marine deployments are expensive to maintain and repair, WECs must be built for long-term performance using high-quality components. Incorporating redundant sensors and backup systems can further enhance the reliability of control units, minimizing downtime and ensuring continuous energy generation.

Conclusion

As we transition toward a clean energy future, wave power offers a promising addition to the renewable energy mix. With ongoing technological advancements and an increased focus on environmental sustainability, wave energy can complement solar and wind while addressing the global demand for reliable, eco-friendly power. Innovative solutions like CorPower Ocean’s wave energy converter demonstrate the potential of this technology to outperform traditional renewables in energy density and efficiency.

As wave energy gains momentum, it will play a vital role in creating a sustainable future by reducing carbon emissions and supporting the transition to a renewable energy economy.

For more details, visit www.mouser.com.

TANAKA Kikinzoku Kogyo Develops TK-SK Palladium Alloy for High-Performance Probe Pins in Semiconductor Testing

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TANAKA Kikinzoku Kogyo K.K., a leading company under TANAKA Precious Metals, has announced the release of TK-SK, a new palladium alloy specifically designed for probe pins used in the final testing stages of semiconductor manufacturing. The new product will be showcased via panel display at SWTest Asia 2024, which will take place on October 24–25, 2024, in Fukuoka Prefecture, Japan. Samples of the TK-SK alloy will be available for shipping by the end of the year.

Features and Advantages of TK-SK Alloy

The TK-SK alloy offers superior hardness, rated at 640HV, making it ideal for test socket applications during the final continuity testing of semiconductor packages (a key back-end process). Traditional palladium alloys used in these applications previously maxed out at 560HV in hardness, limiting their durability. However, using advanced processing techniques, TANAKA Kikinzoku Kogyo has developed TK-SK to significantly enhance the hardness of the probe pins while maintaining machinability and durability.

TANAKA Kikinzoku Kogyo Develops TK-SK Palladium Alloy for High-Performance Probe Pins in Semiconductor Testing
TANAKA Kikinzoku Kogyo Develops TK-SK Palladium Alloy for High-Performance Probe Pins in Semiconductor Testing 5

This new alloy addresses the rising demand for high-hardness probe pins in the semiconductor industry, which must endure intense wear and friction during testing. Probe pins, such as pogo-pin types, often encounter issues like deformation and solder adhesion, which require frequent cleaning and maintenance. The enhanced durability of TK-SK reduces these problems, extending the service life of the pins and lowering maintenance costs for testing equipment.

Overcoming Processing Challenges

Harder materials are often more challenging to machine, and there is an increased risk of breakage during processing. TANAKA’s TK-SK alloy overcomes these challenges with proprietary processing technology, ensuring that the pins remain durable while also being easy to machine. The improved hardness means the probe pins are less likely to deform during repeated contact with test substrates, making them highly suitable for demanding semiconductor testing environments.

The company aims to increase production volumes by 1.5 times by 2028, anticipating a growing need for robust and reliable probe pins as the semiconductor industry expands in the coming years.

TANAKA Kikinzoku Kogyo Develops TK-SK Palladium Alloy for High-Performance Probe Pins in Semiconductor Testing

Exhibition at SWTest Asia 2024

TANAKA Kikinzoku Kogyo will display the TK-SK palladium alloy at SWTest Asia 2024 along with other advanced materials, including:

  • TK-FS wire and sheet
  • Copper-silver alloy (TK-101 sheet) for probe pins
  • Precious metal plating solutions for probe cards

The exhibition will be held at the Hilton Fukuoka Sea Hawk on:

  • October 24 (10:00 AM – 3:30 PM)
  • October 25 (10:00 AM – 4:00 PM)

Visitors can find TANAKA Kikinzoku Kogyo at Booth No. 210 to explore the TK-SK alloy and other innovative products for semiconductor testing.

Looking Ahead: Supporting Semiconductor Market Growth

TANAKA Kikinzoku Kogyo’s focus on developing high-performance materials like TK-SK demonstrates its commitment to supporting the growing semiconductor industry. As semiconductor technologies evolve, the need for high-precision, durable testing components will continue to rise. TANAKA’s new palladium alloy offers an innovative solution, reducing equipment downtime, extending component lifespans, and improving overall testing efficiency.

For more information, visit the official SWTest Asia 2024 website: https://www.swtestasia.org.

Servotech Power Systems Partners with Ensmart Power to Expand EV Charging Network Across the UK and North America

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Servotech Power Systems Ltd., India’s largest manufacturer of electric vehicle (EV) chargers, has entered into an exclusive distribution agreement with UK-based Ensmart Power, a leader in critical power solutions, solar technology, and energy storage systems. This strategic collaboration aims to strengthen the distribution of EV chargers across the UK, North America, and other global markets.

Supporting the Growth of Green Mobility

The partnership is designed to leverage the rising adoption of electric vehicles by combining Servotech’s innovative EV charging technologies with Ensmart Power’s expertise in energy storage and distribution. Together, they aim to build a reliable, accessible EV charging infrastructure to support the growing demand for sustainable transportation. This collaboration is expected to contribute to the creation of a carbon-neutral mobility ecosystem by setting new benchmarks in efficiency, environmental responsibility, and reliability.

A Strategic Expansion for Servotech

Raman Bhatia, Founder and Managing Director of Servotech Power Systems Ltd., emphasized the importance of the partnership:
“This agreement is a key step toward establishing a global footprint and bringing our advanced charging solutions closer to international users, with an emphasis on local production. Our goal is to provide world-class EV chargers to meet the rising demand for green mobility. Through this collaboration, we will also integrate Ensmart Power’s expertise to create a seamless and widely accessible charging network, catering to all electric four-wheelers. This network will improve on-the-go charging experiences for users in the UK and beyond.”

Strengthening Global Partnerships

Deniz Taner, Managing Director of Ensmart Power, expressed excitement about the new collaboration:
“We are delighted to partner with Servotech, a recognized industry leader. Having worked closely with Raman Bhatia for over a decade, this partnership strengthens our long-standing relationship. By cross-pollinating ideas and intellectual property, we aim to accelerate technological innovation and ensure sustainable growth. Our joint efforts will make EV charging solutions more affordable and accessible, easing range anxiety and paving the way for faster charging technologies. This partnership marks a transformative step toward reshaping the future of e-mobility in the UK, North America, and beyond.”

Transforming the Future of E-Mobility

The collaboration between Servotech Power Systems and Ensmart Power aims to make a significant impact on the EV landscape by driving the development of cutting-edge charging infrastructure. With an emphasis on affordability, accessibility, and sustainability, the partnership will provide EV owners with an enhanced charging experience. Additionally, the focus on faster charging speeds and advanced technologies will help position both companies at the forefront of the evolving e-mobility market.

This alliance is expected to address key challenges in the EV industry, including range anxiety, and contribute to a robust, future-ready charging network across multiple regions.

Renesas Electronics Unveils Two New Semiconductor Solutions for the Expanding IO-Link Market

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Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has introduced two new products to support the fast-growing IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 dual-channel resistive sensor signal conditioner IC. These innovations are designed to enhance communication, performance, and efficiency in industrial automation applications.

Understanding IO-Link Technology

IO-Link is a standardized digital communication protocol that connects sensors, actuators, and other devices in an automation system. It offers real-time data exchange, remote monitoring, and diagnostics, making it highly valuable for industrial automation. IO-Link also simplifies wiring, boosts data availability, and integrates smoothly with existing systems. The market for IO-Link is expected to grow by over 20% annually, reaching a projected value of USD 34 billion by 2028 (Source: Infogence Global Research). As a leader in industrial automation solutions, Renesas is committed to driving innovation in this field.

CCE4511 Four-Channel IO-Link Master IC

The CCE4511 is the industry’s first four-channel master IC designed for the IO-Link protocol, delivering 500 mA of drive current per channel. It offers significant advantages over two-channel masters by reducing energy consumption, component counts, and PCB space requirements.

The CCE4511 features:

  • High-voltage interface with built-in overvoltage and over-current protection.
  • Integrated IO-Link Frame Handler that automates low-level communication tasks, reducing the load on microcontrollers (MCUs). This feature enables engineers to use more affordable MCUs or free up processing power for other tasks.
  • Operating temperatures up to 125°C, making it ideal for harsh industrial environments.
  • Support for IO-Link Safety System Extension, with the ability to detect ready pulses from connected devices.

This IC offers an efficient solution for automating communication and monitoring between multiple devices in industrial systems. Its ability to minimize components while maximizing performance makes it an excellent choice for manufacturers seeking cost-efficient designs.

ZSSC3286 Dual-Channel Resistive Sensor Signal Conditioner IC

The ZSSC3286 sensor signal conditioner (SSC) IC is designed to deliver precise amplification, digitization, and correction of sensor signals. With IO-Link readiness built in, the ZSSC3286 integrates a compliant stack that removes the need for an additional microcontroller, reducing board space and costs.

Key features of the ZSSC3286 include:

  • Compatibility with bridge and half-bridge sensors and external voltage elements.
  • Advanced 32-bit ARM-based math core for digital compensation of offset, sensitivity, temperature drift, and non-linearity.
  • Dual 24-bit ADCs for parallel measurement, ensuring high accuracy.
  • Integrated measurement scheduler for performance optimization and advanced system diagnostics.
  • Available in both 40-QFN (5mm x 5mm) and Wafer-Level Chip-Scale Package (WLCSP) formats.

With the ability to digitize and correct sensor data accurately, the ZSSC3286 is ideal for applications where high precision and sensor reliability are critical. Its built-in IO-Link support simplifies integration with smart sensor networks and reduces development complexity.

A Winning Combination: CCE4511 and ZSSC3286

Renesas has paired the CCE4511 master IC and the ZSSC3286 sensor IC with other Renesas products to create a Winning Combination—a pre-tested system architecture designed for seamless compatibility. These optimized designs help customers reduce development risks and speed up time to market.

Renesas offers over 400 Winning Combinations, including embedded processing, power, analog, and connectivity solutions, to provide customers with a range of tools to accelerate product development. To explore these system architectures, visit renesas.com/win.

Availability

The CCE4511 is currently available in a 56-QFN (8mm x 8mm) package, along with the CCE4511-EVAL-V1 evaluation kit, which can be obtained through Renesas and its authorized distributors. For more details, visit renesas.com/CCE4511.

The ZSSC3286 is also available in 40-QFN and WLCSP formats, with its evaluation kit—ZSSC3286EVK—now shipping. More information is available at renesas.com/ZSSC3286.

Conclusion

Renesas’ new CCE4511 four-channel IO-Link master IC and ZSSC3286 dual-channel sensor signal conditioner IC bring cutting-edge solutions to the IO-Link market, addressing the growing demand for smarter, more efficient industrial automation. By simplifying system designs, reducing costs, and enhancing performance, these innovative products position Renesas at the forefront of the industrial connectivity space. With ongoing support through Winning Combinations and evaluation kits, Renesas aims to help customers deploy advanced IO-Link solutions quickly and confidently.

Vishay Intertechnology Expands 299 PHL-4TSI Capacitor Series with Higher Voltage Options

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Vishay Intertechnology, Inc. has announced the expansion of its 299 PHL-4TSI snap-in, four-terminal aluminum electrolytic capacitor family by introducing new 350 V, 500 V, 550 V, and 600 V rated models. These additions offer a wider selection of capacitance-voltage combinations, giving engineers greater flexibility in designing power supplies, inverters for industrial applications, and home appliances. The 299 PHL-4TSI series aims to reduce component counts, lower costs, and increase the mechanical stability and longevity of end products.

Key Features and Benefits

The 299 PHL-4TSI capacitors feature a cylindrical aluminum case with pressure relief and are insulated with a blue sleeve. These devices are designed to operate reliably at temperatures up to 105°C, with a lifespan exceeding 5000 hours, even under high ripple current conditions. Ripple current ratings range from 1.9 A to 7.6 A, enabling designers to meet application requirements with fewer components, improving efficiency and reducing assembly complexity.

The series offers larger can sizes than typical two-terminal snap-in capacitors, ranging from 35 mm x 50 mm to 45 mm x 100 mm. This design feature allows the 299 PHL-4TSI series to replace multiple large screw-terminal capacitors, often connected by bus bars, with smaller components mounted directly to PCBs. This transition to soldered connections minimizes construction costs by eliminating the need for manual mounting.

Enhanced Performance and Mechanical Stability

As polarized aluminum electrolytic capacitors with a non-solid electrolyte, the 299 PHL-4TSI series is well-suited for smoothing, filtering, and energy storage applications. The four-terminal configuration offers several advantages, including:

  • Increased mechanical stability
  • Keyed polarity, preventing incorrect installation
  • Improved performance in high-vibration environments

These capacitors also comply with RoHS and REACH standards, ensuring environmental and regulatory compliance.

Streamlined Production and Availability

With the enhanced design of the 299 PHL-4TSI capacitors, manufacturers can now reduce component complexity while benefiting from cost-efficient PCB-mounted solutions. Production quantities are available with an 18-week lead time, and samples can be requested in small quantities from catalog distributors.

Conclusion

The expansion of Vishay’s 299 PHL-4TSI series with higher voltage options offers designers increased flexibility for a wide range of applications, including industrial power supplies and appliance inverters. By combining high ripple current ratings, long operational lifespans, and improved mechanical stability, these capacitors provide a cost-effective solution for enhanced performance and reliability.

For more information, visit Vishay’s official product page.

How IoT is Transforming Agriculture: Innovations, Benefits, and Key Considerations

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The Internet of Things (IoT) is revolutionizing the agricultural industry by enhancing efficiency, sustainability, and productivity. Through the integration of sensors, drones, and smart irrigation systems, IoT provides real-time monitoring and data-driven insights, allowing farmers to make more informed decisions. These innovations are reshaping traditional farming methods, helping businesses improve resource management, optimize operations, and achieve higher crop yields.

In this article, we explore what IoT is, how it improves crop monitoring and irrigation, real-world applications, and challenges farmers may encounter when adopting these technologies.

What is Smart Farming?

Smart farming, also known as agtech or precision agriculture, uses IoT technologies to optimize farm operations. By deploying sensors, drones, and connected devices, farmers gain access to real-time data on crop health, soil conditions, weather patterns, and equipment performance. This interconnected system promotes operational efficiency, leading to better resource management and higher productivity.

The core goal of smart farming is to promote sustainability by reducing water consumption, minimizing chemical use, and preventing environmental degradation. With these advances, farmers can reduce costs, increase yields, and provide safer working environments, all while protecting natural resources.

Smart farming is becoming especially important as the agriculture sector faces labor shortages and limited resources, making it a promising solution for a greener and more sustainable future.

Benefits of IoT in Agriculture

Implementing IoT technologies in agriculture offers several key advantages:

1. Data-Driven Insights

IoT devices gather valuable data about soil conditions, weather forecasts, crop health, and livestock behavior. This information helps farmers make informed decisions that boost productivity while minimizing waste. For example, soil sensors can notify farmers about optimal watering times, ensuring efficient water usage and healthier crops.

2. Risk Management

Agriculture is inherently risky due to unpredictable factors like weather, pests, and diseases. IoT tools provide early warning systems and predictive analytics that help farmers manage risks proactively. With alerts about potential issues, such as extreme weather or pest outbreaks, farmers can take timely action to protect their crops and livestock. This reduces the likelihood of crop failures and minimizes financial losses.

3. Automation and Efficiency

IoT simplifies farm operations by automating tasks such as watering, fertilizing, and harvesting. Automated logistics systems also streamline the transport of harvested crops, reducing spoilage and improving profits. These smart technologies help farmers save time and labor costs without compromising precision.

4. Enhanced Product Quality

By maintaining optimal growing conditions for crops and livestock, IoT ensures higher-quality yields. This allows farmers to command better prices in the market and offer superior products to consumers.

Use Cases of IoT in Agriculture

IoT has already found its way into various agricultural applications, transforming how farms operate. Here are some real-world examples:

1. Livestock Monitoring

Monitoring livestock traditionally required significant manual effort. Today, wearable sensors track animals’ vital signs, feeding patterns, and activity levels in real time. If an animal shows signs of illness or strays from the herd, the system sends instant alerts to the farmer, facilitating prompt interventions—like having a virtual vet available 24/7.

2. Weather Monitoring and Forecasting

Weather plays a crucial role in farming operations. IoT-enabled sensors placed around the farm collect data on temperature, humidity, and soil moisture. With this information, farmers can better plan planting schedules and adjust irrigation to avoid weather-related setbacks. It’s like having a crystal ball that helps farmers predict the best time to sow, water, or harvest their crops.

3. Automated Greenhouses

Automated greenhouses are a natural fit for IoT technologies. Sensors control temperature, humidity, lighting, and soil moisture to create ideal growing conditions without constant supervision. These systems work like a team of expert gardeners, maintaining plant health and maximizing crop yields.

4. Crop Health Monitoring with Drones

IoT-enabled drones and ground sensors provide a detailed view of crop health. They can detect signs of diseases, pests, or nutrient deficiencies early, giving farmers a window to take corrective action before issues escalate. This system acts like a vigilant scout, monitoring crops and ensuring farmers respond to problems promptly.

5. Integrated Farm Management Systems

IoT solutions allow farmers to centralize all aspects of farm management. With integrated platforms, they can monitor planting schedules, equipment performance, and resource usage from a single interface. Farmers can access real-time analytics through smartphones or computers, making it easier to manage day-to-day operations remotely.

6. Drones for Mapping and Crop Treatment

Drones equipped with advanced sensors can create detailed maps of farmland, monitor crop health, and apply fertilizers or pesticides with precision. They work faster and more accurately than manual labor, covering large areas efficiently and improving crop care.

Key Considerations When Deploying IoT in Agriculture

Adopting IoT technologies requires careful planning. Here are some factors to consider:

1. Identify Specific Farm Needs

Each farm has unique requirements based on crop type, livestock, and environmental conditions. Understanding these needs helps farmers choose the right IoT solutions tailored to their operations.

2. Connectivity Challenges

Rural areas often lack reliable internet access, which can hinder IoT implementation. Farmers should explore resilient communication networks such as LPWAN, satellite links, or cellular networks to ensure seamless connectivity.

3. Data Security and Privacy

Agricultural data is valuable and must be protected from cyber threats. Encryption, secure data storage, and regular security updates are essential to prevent unauthorized access to sensitive information.

4. Power Management

Many IoT devices operate in remote locations with limited access to electricity. Farmers should evaluate the energy needs of sensors and devices and explore solar-powered options or durable batteries to ensure continuous operation with minimal downtime.

5. System Integration

To maximize efficiency, IoT solutions must be compatible with existing farm systems and equipment. Ensuring interoperability between new and old technologies will provide a holistic approach to farm management.

6. Cost Considerations

IoT implementation can be expensive, both initially and for ongoing operations. Farmers need to assess the return on investment by calculating the benefits in terms of efficiency, productivity, and resource savings.

Conclusion

IoT is transforming agriculture by enabling smarter, more sustainable farming practices. From automated greenhouses and drone-assisted crop monitoring to livestock management and weather forecasting, IoT solutions empower farmers with the tools they need to boost efficiency, reduce risks, and improve product quality.

However, deploying IoT in agriculture comes with challenges, including connectivity issues, data security, and integration complexities. Careful planning and tailored solutions are essential to overcome these obstacles and unlock the full potential of IoT on the farm. As technology continues to evolve, IoT will play an increasingly crucial role in creating a sustainable future for agriculture, helping farmers adapt to new challenges while ensuring better outcomes for the planet.

Author Bio
Yuliya Melnik is a technical writer at Cleveroad, a software development company based in Ukraine. She is passionate about innovative technologies that make the world a better place and enjoys crafting content that inspires and informs readers.

AVEVA Showcases Next-Generation Digital Transformation Solutions at AVEVA World 2024

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AVEVA, a global leader in industrial software and a driving force behind digital transformation and sustainability, has unveiled exciting new developments to CONNECT and introduced several key product innovations at AVEVA World 2024 in Paris. The event highlights AVEVA’s vision for how AI-powered solutions and connected digital ecosystems can unlock new efficiencies, agility, and sustainability for industries.

AVEVA World 2024: A Platform for Innovation and Collaboration

With more than 3,500 industry leaders and experts attending, AVEVA World 2024 offers an immersive experience where participants can explore the company’s latest solutions, attend keynote sessions with industry giants like Michelin and Databricks, and engage in hands-on activities at the event’s expo. The focus is on showcasing how AVEVA’s integrated technologies and CONNECT platform enable the creation of digitally connected, AI-powered ecosystems that enhance operational performance and accelerate decision-making.

New Product Announcements and Enhancements

During the event, Rob McGreevy, Chief Product Officer at AVEVA, detailed how the company’s evolving product portfolio is strengthening integration and expanding the CONNECT platform to drive digital transformation. Among the significant product releases are:

  • AVEVA Unified Engineering
  • AVEVA Operations Control
  • AVEVA PI Data Infrastructure
  • Industrial AI Assistant

These innovations offer new ways for businesses to maximize the value of existing systems and explore data sharing, digital twin visualization, AI-driven analytics, and cross-team collaboration, helping customers achieve new levels of operational efficiency and agility.

AVEVA Unified Engineering: Breaking Down Silos

AVEVA Unified Engineering transforms the way multidisciplinary, global teams collaborate on complex projects by consolidating 1D, 2D, and 3D data into a single digital environment. The solution eliminates the inefficiencies of traditional document-based workflows, enabling teams from different organizations and disciplines to work seamlessly with up-to-date project data.

This collaborative platform empowers businesses to optimize plant designs through transparent, data-driven decision-making, ensuring projects stay on time and within budget. “By bringing design tools together in a quick-to-deploy, connected platform, Unified Engineering enables real-time collaboration and reduces inconsistencies,” McGreevy noted.

AVEVA Operations Control: Complete Operational Flexibility

AVEVA Operations Control offers a comprehensive set of operational tools with unlimited access to HMI/SCADA, historian, reporting, and collaboration features—without constraints on tags, I/O, or server capacity. Designed to support everything from plant operations to enterprise-level management, the platform delivers unmatched architectural flexibility.

With integrated AI-powered analytics and pre-configured dashboards, the system helps users optimize production processes and monitor quality. The platform also benefits from new CONNECT integration, allowing real-time insights via AI assistants that analyze both process and MES data to offer actionable recommendations.

“By combining Operations Control with the CONNECT platform, users gain access to purpose-built AI tools for boosting productivity, sustainability, and operational performance,” added McGreevy.

Expanding AVEVA PI Data Infrastructure for Real-Time Collaboration

AVEVA continues to expand its PI Data Infrastructure with enhancements that make it easier for customers to integrate and manage operational data. The new features include write-back capabilities that allow operators and analysts to collaborate in real time by sending data back to the PI Server via the CONNECT platform.

These improvements enable seamless data management across edge devices, plant systems, and cloud environments, giving companies greater agility and scalability. “Our enhanced PI Data Infrastructure allows businesses to use real-time data in new ways, supporting everything from advanced analytics to operational optimization,” McGreevy explained.

Innovative Use Cases Powered by CONNECT

Beyond its flagship products, AVEVA is also showcasing additional features enabled through CONNECT and its partner ecosystem. Key highlights include:

  • Generative engineering design for optimized plant and product creation
  • Improved production planning and MES capabilities
  • Performance monitoring and simulation tools to enhance uptime and productivity
  • AI-driven optimization for greater operational agility

These new tools and use cases ensure that AVEVA’s customers extend the value of their investments while staying ahead of market demands for digitalization and sustainability.

A Commitment to Digital Transformation and Sustainability

With its focus on AI integration, cloud-based collaboration, and real-time data management, AVEVA continues to push the boundaries of industrial software innovation. By leveraging the CONNECT platform and introducing purpose-built AI tools, AVEVA ensures its customers can optimize performance, reduce costs, and meet sustainability goals.

“We are committed to driving digital transformation and sustainable business practices,” McGreevy emphasized. “Our goal is to provide companies with the tools they need to accelerate innovation and unlock new levels of efficiency and performance.”

Conclusion

The innovations unveiled at AVEVA World 2024 reflect the company’s ongoing commitment to delivering transformative technologies for its customers. Through expanded product integration, AI capabilities, and enhanced data infrastructure, AVEVA is empowering businesses to thrive in an increasingly digital world. With solutions that support real-time collaboration, data-driven decision-making, and operational optimization, AVEVA ensures its customers are well-positioned to succeed both now and in the future.

Infineon Launches SECORA Pay Green: Pioneering Eco-Friendly Payment Card Technology

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Infineon Technologies AG is taking significant strides toward reducing plastic waste and CO₂ emissions in the payment card industry with the introduction of SECORA Pay Green. This new solution allows the production of the world’s first fully recyclable dual-interface contactless payment cards made from sustainable materials, marking a major breakthrough in environmentally friendly financial technologies.

Collaborations to Drive Adoption of Green Payment Cards

Infineon has begun collaborating with payment card manufacturers, banks, and payment schemes to initiate pilot programs for SECORA Pay Green. These early efforts aim to demonstrate the potential of eco-friendly cards and pave the way for widespread adoption. Mass production will follow once the initial pilots are successfully executed, accelerating the transition to sustainable payment cards across the industry.

A New Standard for Recyclable Card Design

Conventional contactless payment cards are difficult to recycle because they require embedding a copper wire antenna within multiple material layers, such as inlay foils. However, SECORA Pay Green introduces a revolutionary approach by integrating a Coil-on-Module (eCoM) package. This compact module contains the security controller, software components, and antenna, eliminating the need for copper wiring.

At the end of the card’s lifecycle, the eCoM module can be separated from the card and disposed of as electronic waste, while the card body—whether made from plastic, wood, or paper—can be easily recycled. This innovation significantly simplifies the recycling process and reduces the environmental impact of payment card manufacturing.

Reducing CO₂ Emissions and Resource Consumption

SECORA Pay Green helps cut carbon emissions by over 60% compared to traditional card systems. The new design reduces reliance on copper and streamlines logistics for material sourcing, contributing to lower CO₂ emissions throughout the supply chain. Each batch of 1,000 SECORA Pay Green cards generates 27.10 kg of CO₂e, compared to 90.08 kg of CO₂e for standard card systems.

“We are committed to driving decarbonization and digitalization,” said Thomas Rosteck, Division President Connected Secure Systems at Infineon. “SECORA Pay Green sets a new benchmark for sustainable payment solutions, helping financial institutions offer environmentally friendly products while meeting growing consumer demand for green banking.”

Industry Leaders Embrace SECORA Pay Green

Several industry leaders have praised Infineon’s SECORA Pay Green initiative:

  • Mastercard, a long-time advocate of sustainable card production, has expressed support for the innovation. “Infineon’s efforts show the importance of reimagining products to reduce environmental impact,” said Joe Pitcher, Vice President of Mastercard’s Sustainable Card Program. “We encourage vendors to adopt more ambitious sustainability goals, and Infineon’s SECORA Pay Green is an exciting step forward.”
  • CPI Card Group, a major card manufacturer, has also integrated the new chip into its product offerings. Toni Thompson, EVP of Credit and Debit Solutions, commented: “The SECORA Pay Green chip helps us expand our eco-friendly portfolio, delivering both convenience and sustainability to our clients.”
  • Perfect Plastic Printing has similarly lauded the innovation. Mike Sabatini, Senior Vice President of Manufacturing, noted: “Our collaboration with Infineon has enabled us to reduce environmental impact and adopt renewable materials in card production. SECORA Pay Green will allow us to deliver secure and innovative cards with lower carbon emissions.”

Ease of Implementation and Consumer Benefits

SECORA Pay Green is designed to seamlessly integrate into existing dual-interface card production facilities, minimizing the need for complex adjustments and speeding up adoption. The eCoM module is also optimized to work with smartphone antennas, providing users with reliable tap-to-mobile functionality for convenient, contactless payments.

This innovative solution supports various sustainable materials, including:

  • Recycled PVC (rPVC)
  • Recycled PETG (rPETG)
  • PLA (a biodegradable plastic)
  • Ocean-bound plastic
  • Wood and paper

As consumers increasingly gravitate toward eco-friendly products, financial institutions have a unique opportunity to enhance brand loyalty by offering sustainable payment cards. Regulatory pressures are also intensifying, with growing expectations for environmentally responsible practices in the financial sector. Research predicts that by 2028, global shipments of rPVC-based cards will reach 1.2 billion units, compared to just 226 million cards in 2022 (Source: ABI Research, 2023).

Conclusion: Shaping a Greener Future for the Payment Industry

Infineon’s SECORA Pay Green is not just a technological innovation—it represents a shift toward sustainability in the financial industry. By reducing CO₂ emissions, enabling easy recycling, and integrating eco-friendly materials, SECORA Pay Green empowers financial institutions and card manufacturers to make a positive environmental impact.

As the demand for sustainable solutions continues to rise, Infineon’s SECORA Pay Green offers a plug-and-play solution that combines performance, convenience, and environmental responsibility—setting the stage for a greener future in the payment industry.

To learn more, visit www.infineon.com/secorapaygreen.

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