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Microchip Technology Expands Wi-Fi Portfolio to Meet Growing Connectivity Demands in Industrial and Commercial Applications

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With the rapid evolution of Industry 4.0, Artificial Intelligence (AI), digitized manufacturing, and the Internet of Things (IoT), the need for reliable wireless connectivity in commercial and industrial environments is rising at an unprecedented pace. These applications often face challenging conditions, such as high temperatures, interference, and physical obstructions, requiring advanced connectivity solutions. To address these challenges, Microchip Technology has introduced 20 new products to its extensive Wi-Fi product portfolio, reinforcing its position as a leader in wireless connectivity solutions.


Versatile Wi-Fi Solutions for a Range of Applications

Microchip’s latest Wi-Fi products include microcontrollers (MCUs), network controllers, link controllers, and plug-and-play modules, all aimed at simplifying development and accelerating time to market. These solutions cater to varying application requirements and developer skill levels, offering flexibility for everything from simple connectivity to industrial-grade applications.

The portfolio offers:

  • Wi-Fi MCUs: Combining MCU functionality with wireless connectivity in a single device.
  • Link Controllers: Adding Wi-Fi capabilities to Linux-based microprocessors (MPUs) via SDIO interfaces.
  • Network Controllers: Providing wireless connectivity to MCUs through SPI interfaces.
  • Plug-and-Play Modules: Enabling fast wireless-to-cloud connectivity using simple text commands over UART interfaces.

Industry-Leading Expertise and Ecosystem Support

“With decades of experience as a trusted MCU provider, Microchip has leveraged its expertise to build a comprehensive Wi-Fi portfolio that meets today’s most advanced application needs,” said Rishi Vasuki, Vice President of Microchip’s Wireless Solutions Business Unit. “Our wireless solutions are designed to excel in environments where precision sensing, motor control, and other industrial processes need to operate reliably under harsh conditions.”


Cutting-Edge Products in the Microchip Wi-Fi Portfolio

The latest PIC32MZ-W1 Wi-Fi MCUs build on Microchip’s popular 32-bit MCU series, offering advanced features such as CAN, Ethernet, capacitive touch, and analog-to-digital converters (ADC). These MCUs are known for their exceptional GPIO capabilities, providing developers with the versatility required for complex applications.

The expanded portfolio also introduces the next-generation WINCS02 network controllers and WILCS02 link controllers, both of which offer enhanced radio performance and improved security features. These new controllers are pin-to-pin compatible with previous generations, making it easy for developers to migrate from older designs without major rework.

Microchip has also enhanced its plug-and-play solutions with the new RNWF02 modules, which allow MCUs to connect to cloud platforms using straightforward ASCII commands over UART. These modules simplify wireless-to-cloud integration, helping developers connect devices to cloud services with minimal programming.


Secure Connectivity with Integrated Trust Platform

Ensuring secure data exchange between devices and the cloud is critical for IoT and industrial applications. To streamline the process of secure authentication, Microchip has embedded its Trust Platform into many of its Wi-Fi products. The Trust&GO module variants are pre-configured to authenticate with popular cloud providers like AWS and Microsoft Azure, making it easier for developers to implement secure connections.


Proven Performance in Industrial Applications

Millions of Microchip Wi-Fi devices are already powering industrial applications worldwide, delivering robust connectivity, enhanced security, and long-term reliability throughout their lifecycle. These products are designed to integrate easily into diverse environments, ensuring seamless performance across a wide range of use cases.


Comprehensive Development Tools and Support

Microchip backs its Wi-Fi portfolio with a full suite of development tools, including:

  • Application demos
  • Evaluation boards
  • Design services
  • Free design checks to ensure high-quality product development

These tools and services provide developers with the resources they need to accelerate product design and bring their ideas to market efficiently.


Conclusion

As the demand for wireless connectivity continues to grow across industrial and commercial sectors, Microchip Technology remains at the forefront of innovation with its expanded Wi-Fi portfolio. By combining advanced MCUs, plug-and-play modules, and robust controllers, Microchip offers developers the tools to create secure, efficient, and reliable wireless solutions. Whether in precision sensing, motor control, or cloud-based IoT applications, Microchip’s Wi-Fi products are designed to meet the challenges of today’s connected world.

For more details, visit Microchip’s Embedded Wireless Connectivity Products web page.

PROSE Technologies Unveils ‘PROTREEM’ Passive Antenna Family to Boost Wireless Communication Efficiency

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PROSE Technologies is showcasing its newly launched ‘PROTREEM’ Passive Antenna Family, a high-performance solution designed to enhance wireless communication through improved radiation efficiency and coverage. The innovative product promises to deliver 20-25% better coverage while reducing energy consumption by 25%, offering telecom operators both cost savings and environmental benefits.


A Game-Changer for the Telecom Industry

According to Arshad Fakhri, President of PROSE Technologies (India Region), the PROTREEM antennas are expected to revolutionize wireless communications in both India and global markets. “The enhanced efficiency of the PROTREEM antenna reduces the need for additional towers, which in turn decreases the challenges related to land acquisition and installation. Furthermore, lower power consumption supports our commitment to sustainability by reducing carbon emissions,” said Fakhri.


Advanced Technology for Superior Performance

The PROTREEM antenna family features innovative technology designed to improve radio frequency (RF) performance. Its Air Stripline structure reduces insertion loss, ensuring better signal strength. Additionally, the product offers:

  • High tilt accuracy for enhanced control over coverage.
  • Optimized pattern performance to expand the service area.
  • High directivity and advanced beam shaping for efficient signal transmission.

These capabilities allow network operators to achieve broader coverage with fewer antennas, minimizing infrastructure requirements while maintaining high-quality communication services.


Patented Technology and Robust Design

The PROTREEM antenna is built using several patented technologies, including a specialized radome design and end cap solutions that improve durability and performance. This makes it a first-of-its-kind product in the wireless communications sector. PROSE Technologies has prioritized both efficiency and sustainability, incorporating recycled plastic and reducing soldering joints by 75%, which enhances product longevity and reduces environmental impact.


Supporting Global Telecom Operators

With a presence in 68 countries, PROSE Technologies currently serves over 100 network operators and service providers. The company’s in-house R&D and manufacturing processes ensure high-quality, sustainable production. The introduction of the PROTREEM antenna family aligns with PROSE’s ongoing focus on automation, with manufacturing efficiency increased by 40%.


A Sustainable Step Forward for Telecom Networks

The PROTREEM antenna not only improves operational efficiency but also contributes to sustainability goals. By reducing power consumption and reliance on additional infrastructure, it helps telecom providers lower energy costs and carbon emissions. PROSE Technologies’ commitment to green manufacturing practices further reinforces its leadership in sustainable telecom solutions.


Conclusion

The PROTREEM Passive Antenna Family from PROSE Technologies represents a significant leap forward in wireless communication. With improved RF performance, energy efficiency, and innovative design, the new antenna solution offers cost-effective and sustainable benefits to operators worldwide. As the telecom industry continues to evolve, PROSE Technologies is well-positioned to support operators in meeting both performance demands and environmental goals.

C-TOUCH & DISPLAY SHENZHEN 2024

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Event Name: C-TOUCH & DISPLAY SHENZHEN 2024
Dates: November 6-8, 2024
Location: Shenzhen World Exhibition & Convention Center


About C-TOUCH & DISPLAY SHENZHEN 2024

C-TOUCH & DISPLAY SHENZHEN 2024 is Asia’s leading B2B trade event for showcasing the latest advancements in smart touch technologies and new display innovations. The event brings together top suppliers in the touch and display industries with finished product manufacturers to explore and shape the future of cutting-edge technology.


A Unified Platform for Multiple Industries

This year’s edition will feature an exciting combination of five exhibitions under one roof, including:

  • Commercial Display 2024
  • AUTOMOTIVE WORLD CHINA 2024
  • AMTS & AHTE South China 2024
  • NEPCON ASIA 2024

Held at the 160,000-square-meter Shenzhen 2024 World Exhibition & Convention Center, the event promises to deliver unmatched scale and impact. With more than 3,000 exhibitors and 50,000 professional visitors expected from around the world, C-TOUCH & DISPLAY SHENZHEN 2024 is poised to become a landmark event in the industry.


Discover the Latest in Innovation and Technology

C-TOUCH & DISPLAY SHENZHEN 2024 will spotlight breakthrough technologies in areas such as:

  • Smart touch manufacturing and next-gen displays
  • Electronic component production
  • Semiconductor packaging and testing
  • Automotive electronics
  • Advanced materials and intelligent manufacturing solutions

This event provides a unique platform for professionals in the consumer electronics, automotive, and display industries to discover the latest trends, technologies, and production techniques essential for driving future innovation.


An Unmatched Opportunity for Business and Collaboration

C-TOUCH & DISPLAY SHENZHEN 2024 offers a one-stop platform that enables attendees to:

  • Meet procurement needs through diverse sourcing opportunities
  • Engage in technology exchanges with industry leaders
  • Build strategic partnerships to drive business growth

With its focus on innovation and collaboration, the event aims to help companies stay competitive in a rapidly evolving market while fostering long-term partnerships.


Join Us in Shenzhen 2024

C-TOUCH & DISPLAY SHENZHEN 2024 is your chance to explore the future of smart touch and display technologies while connecting with industry professionals, suppliers, and thought leaders. Whether you’re looking to discover the latest technological breakthroughs, source materials, or network with leading brands, this event offers everything you need under one roof.

Don’t miss out on the opportunity to be part of the next wave of innovation—join us from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center for this world-class event.

For More Information Visit here

The Rise of 3D Manufacturing: Challenges, Progress, and Future Trends

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The introduction of the first commercially available 3D printer in 1987 sparked excitement about how additive manufacturing could transform industries ranging from manufacturing to construction to medical research. However, it took several decades for the technology to evolve to the point where it could be applied meaningfully beyond niche uses.

In the 2020s, advancements in additive manufacturing began to unlock widespread commercial potential, with benefits that include:

  • Simplified production processes through single-part assemblies
  • Greater design freedom and efficiency
  • Faster lead times for product development and low-volume manufacturing
  • On-demand production boosting supply chain resilience
  • Lower logistics costs
  • Sustainable and flexible operations

Despite these breakthroughs, additive manufacturing still accounts for only 0.1% of the total manufacturing market, underscoring the challenges the technology has yet to overcome. In this article, we’ll explore the evolution, obstacles, and emerging trends that are shaping the future of 3D printing and its broader adoption.


The Growing Pains of Additive Manufacturing

While 3D printing offers exciting opportunities, it faces several challenges that have slowed its integration into large-scale manufacturing. One of the primary hurdles is cost. Industrial-grade 3D printers remain expensive, making it difficult for many businesses to adopt the technology at scale. Additionally, software limitations—a legacy of the technology’s origins in prototyping—have created bottlenecks for mass production and made it difficult to integrate with digitally enabled factories.

Another challenge lies in quality control. Even small errors during the printing process can ruin a product, making precision and consistency critical. Furthermore, 3D printing often requires specialized knowledge of CAD (computer-aided design) modeling. Pre-made CAD models are frequently of poor quality or defective, adding complexity to production workflows.

Until recently, material limitations further restricted the technology’s potential. For years, 3D printing was largely limited to plastics and polylactic acids (PLAs). While the range of materials has expanded to include metals, composites, and powders, effective management of these materials remains an ongoing challenge.

Construction has also been slow to adopt 3D printing due to regulatory requirements. Building materials must undergo extensive testing to meet safety codes, a process that is both expensive and time-consuming, further delaying adoption.


The Current State of Additive Manufacturing

While additive manufacturing has traditionally been associated with prototyping and tooling, recent advancements in technology and affordability are pushing it toward broader commercial applications. Here’s what has changed in 2024:

  • Lower costs with the introduction of affordable mid-range 3D printers
  • Improved software and hardware resulting in faster, more precise production
  • Expanded training programs and ecosystems, reducing the technical barrier for entry
  • Sustainability-focused initiatives, with new eco-friendly materials
  • Market consolidation and collaborations fueling faster innovation
  • Support for high-volume production, making it easier to transition from prototypes to serialized products

Emerging Trends in Additive Manufacturing

Several trends are now reshaping the additive manufacturing industry, enabling new applications across diverse sectors:

1. Advanced Materials

The use of high-performance alloys, metals, and biocompatible materials has opened doors to innovative applications, including food-grade products and bioprinting with living cells for medical use.

2. Artificial Intelligence

Generative AI integrated with 3D printing software enhances print accuracy by making real-time adjustments during production. AI also simplifies workflows, reducing the learning curve for operators.

3. Serialized Production

The development of larger and more efficient 3D printers now allows companies to automate and scale production. This shift toward serialized manufacturing is transforming 3D printing into a viable option for mass production.

4. 5G Integration

5G technology enables real-time monitoring and control of printing operations, making on-site manufacturing more practical. This allows businesses to produce components where they are needed, reducing supply chain delays.


Innovative Applications of 3D Printing

With these advancements, additive manufacturing is finding innovative new uses across industries:

1. Bioprinting Breakthroughs

In early 2024, Korean surgeons performed the first-ever transplant of a 3D-printed windpipe, made from stem cells. This breakthrough demonstrates how bioprinting could eventually lead to customized organs, bones, teeth, muscles, and even limbs. Beyond organ transplants, 3D printing is already being used to produce surgical instruments, dental tools, and emergency supplies, with potential for on-site drug manufacturing in pharmacies.

2. Reconstruction and Forensics

Archaeologists, anthropologists, and forensic scientists are using 3D printing to recreate ancient artifacts, skeletons, and entire cities. Combined with AI technologies, these reconstructions offer unprecedented insights into historical events, crime scenes, and ancient civilizations.

3. On-Demand Consumer Goods

As 3D printing technology becomes more advanced, businesses are exploring customized, on-demand manufacturing. Imagine purchasing a product that is printed to your exact specifications at the time of sale—ushering in an era of personalized consumer goods.

4. Space Exploration

3D printing holds enormous potential for space missions. Future spacecraft could be equipped with 3D printers capable of manufacturing tools, replacement parts, or supplies during the journey. This would reduce payloads and simplify mission logistics. On a larger scale, 3D printing could play a role in stellar construction and even planetary terraforming.


The Future: Hybrid Manufacturing

While traditional manufacturing will continue to dominate high-volume production, additive manufacturing offers unique benefits that complement existing processes. Rather than replacing conventional manufacturing, the future lies in hybrid approaches. For example, automotive, aerospace, and construction industries can leverage 3D printing for custom parts and prototyping, while relying on traditional manufacturing for mass production.

This hybrid strategy allows businesses to adapt to market needs more quickly, offering customization, flexibility, and cost-efficiency without compromising on scale.


Conclusion

3D manufacturing has come a long way since the introduction of the first 3D printer in 1987, evolving from a niche prototyping tool into a promising technology with applications across multiple industries. While it still faces challenges—such as cost, material management, and regulatory hurdles—new advancements are bringing the technology closer to mainstream adoption.

With trends like AI integration, advanced materials, and serialized production leading the way, 3D printing is poised to transform sectors from healthcare and construction to space exploration and consumer goods. However, the future lies not in replacing traditional methods but in combining additive manufacturing with conventional techniques to unlock new possibilities. This synergy between old and new manufacturing methods will shape the next generation of innovation.

Avnet Launches New App for Autodesk Fusion to Streamline Design Workflow

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Avnet has introduced a powerful new add-in for Autodesk Fusion, giving design engineers access to a wide range of reference design schematics, component data, and supply chain insights. With this tool, engineers can efficiently search for parts, analyze project costs, and explore alternate components directly within the Fusion platform, enhancing both design and manufacturing workflows.

This marks Avnet as the first company to offer such comprehensive design tools as a globally available add-in for Autodesk Fusion, a cloud-based platform for 3D modeling, CAD, CAM, PCB, and mechanical engineering. The Avnet App empowers engineers to meet functional, budgetary, and manufacturing requirements while tracking lifecycle timelines.


Key Features of the Avnet App

The Avnet App integrates seamlessly with Autodesk Fusion, offering a wide range of tools to assist engineers throughout the design process, including:

  • Part search engine with real-time availability and lead-time information.
  • Alternates library for quick identification of substitute components.
  • Project cost analysis and supply chain health monitoring.
  • Datasheets and component symbols for easy reference and integration.
  • Access to a library of reference designs and schematics that can be added to projects with just a few clicks.

These features aim to simplify design processes and reduce development time, making it easier for engineers to focus on product performance without compromising on budget or manufacturability.


Enhancing Design Efficiency with Cloud Integration

By embedding these capabilities within Autodesk Fusion, engineers gain access to up-to-date component data and supply chain information directly from the cloud. This ensures that critical design decisions are based on current market trends and reliable sourcing options. Engineers can not only build accurate product models but also ensure that components are available and cost-effective throughout the product’s development lifecycle.


Supporting Early Design and Product Development

“Avnet’s goal is to provide valuable tools that assist engineers during the early stages of product design and realization,” said Chris Jackson, Vice President of Digital Strategy and Innovation at Avnet. “With the Avnet App, engineers have direct access to reference schematics and project descriptions, which they can integrate into their designs in just a few clicks—saving time and effort.”

This tool enhances Avnet’s role as a key technology partner, helping engineers achieve better design outcomes while staying on top of cost targets and supply chain risks.


Conclusion

The Avnet App for Autodesk Fusion brings powerful new tools to design engineers, combining component data, cost insights, and reference schematics within a single platform. By streamlining the design-to-manufacturing process, the app helps engineers develop products that meet performance, cost, and manufacturing goals more efficiently. With cloud-based integration and fast access to alternate components, engineers are better equipped to handle supply chain challenges and product lifecycle management.

This new tool demonstrates Avnet’s commitment to innovation and support for engineers throughout the entire design journey—from concept to final product.

Infineon Technologies Unveils HybridPACK Drive G2 Fusion: A New Standard in Power Modules for E-Mobility

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In a move to make electric mobility more accessible, Infineon Technologies AG has introduced the HybridPACK Drive G2 Fusion, a new power module designed specifically for traction inverters in e-mobility applications. This innovative module sets a new standard by combining silicon (Si) and silicon carbide (SiC) technologies, offering an optimal blend of performance, efficiency, and affordability. With this breakthrough, Infineon aims to provide automakers and system suppliers with greater flexibility in designing high-performance, cost-effective electric vehicle (EV) inverters.


A Smart Combination of Silicon and Silicon Carbide Technologies

One of the key innovations in the HybridPACK Drive G2 Fusion module is its ability to balance cost and efficiency by utilizing both silicon and SiC components. While SiC technology offers superior performance in terms of thermal conductivity, breakdown voltage, and switching speed, it is also more expensive than traditional silicon-based modules.

This hybrid approach allows system suppliers to reduce the overall amount of SiC used in each vehicle, without sacrificing performance. With 30% SiC and 70% silicon, the HybridPACK Drive G2 Fusion achieves nearly the same efficiency as a full SiC-based inverter, but at a much lower cost.


Infineon’s Leadership in Automotive Semiconductor Innovation

“The HybridPACK Drive G2 Fusion represents Infineon’s continued leadership in automotive semiconductors,” said Negar Soufi-Amlashi, Senior Vice President and General Manager of High Voltage at Infineon’s Automotive division. “As the demand for greater driving range in electric vehicles grows, this solution provides an ideal blend of performance and cost-effectiveness. It integrates seamlessly into existing systems, offering a compelling alternative to full SiC solutions without adding complexity for system suppliers and vehicle manufacturers.”


Seamless Integration and High Performance

The HybridPACK Drive G2 Fusion extends Infineon’s HybridPACK Drive portfolio by offering a plug-and-play solution that can be quickly incorporated into automotive systems. Its design eliminates the need for complex reconfigurations when migrating from fully silicon-based or SiC-based modules to the new hybrid module.

The HybridPACK Drive G2 Fusion module offers:

  • Up to 220 kW power output in the 750 V class.
  • Operating temperature range from -40°C to +175°C, ensuring reliability in extreme environments.
  • Improved thermal conductivity for enhanced performance.

This hybrid power module leverages Infineon’s CoolSiC technology alongside silicon IGBT EDT3 technology, both of which enable fast switching and high efficiency. Additionally, the design allows for the use of either single or dual gate drivers, making it easy for manufacturers to transition from traditional silicon or SiC inverters to the hybrid solution.


Cost Savings Without Compromising on Quality

Infineon’s expertise in power module packaging and semiconductor technology plays a crucial role in delivering premium performance while maintaining cost-efficiency. The HybridPACK Drive G2 Fusion module integrates features such as:

  • Swoboda or XENSIV Hall sensors for precise and efficient motor control.
  • Advanced MOSFET and IGBT technologies that contribute to system-level cost savings.

This integration reduces the need for external components and optimizes system performance, resulting in a highly reliable, scalable power module for automotive applications.


Conclusion

Infineon’s HybridPACK Drive G2 Fusion module offers a revolutionary solution for the e-mobility industry by combining the best attributes of silicon and silicon carbide technologies. It provides automakers and system suppliers with the flexibility to design high-performance inverters at a reduced cost, supporting the growing demand for more affordable and efficient electric vehicles.

With its plug-and-play integration, improved thermal management, and modular design, the HybridPACK Drive G2 Fusion sets a new standard in power modules for electric mobility. By making advanced technology more accessible, Infineon is helping drive the adoption of sustainable transportation solutions worldwide.


FAQs

1. What makes the HybridPACK Drive G2 Fusion unique?
The module’s hybrid design combines 30% silicon carbide (SiC) with 70% silicon, achieving nearly the same efficiency as a full SiC solution but at a lower cost.

2. What power output does the module offer?
The HybridPACK Drive G2 Fusion provides up to 220 kW in the 750 V class, making it suitable for a range of electric vehicle applications.

3. How does the module improve thermal management?
The module leverages Infineon’s CoolSiC technology to enhance thermal conductivity, ensuring reliable performance across a wide temperature range.

4. Can the module be easily integrated into existing systems?
Yes, the HybridPACK Drive G2 Fusion offers plug-and-play compatibility and supports both single and dual gate drivers, enabling quick integration without major design changes.

5. What sensors are integrated into the HybridPACK Drive G2 Fusion?
The module incorporates Swoboda or XENSIV Hall sensors for accurate motor control, further enhancing system efficiency.

Venturi Space and Astrolab Collaborate to Launch New Lunar Rover Prototype at International Astronautical Congress

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Venturi Space, known for developing mobility solutions capable of withstanding the harsh conditions on the Moon and Mars, and Venturi Astrolab, Inc. (Astrolab), a leading designer and manufacturer of multi-purpose rovers, have announced a partnership to build a new lunar rover. The rover aims to meet the needs of scientific, institutional, and commercial customers in the U.S. and Europe seeking lunar payload solutions. A prototype of the vehicle was officially revealed at Venturi Space’s booth during the 75th International Astronautical Congress.


Introducing FLIP: A New Era in Lunar Mobility

The rover, currently referred to by its internal name FLIP (FLEX Lunar Innovation Platform), draws from the technology and design framework of Astrolab’s FLEX rover, introduced in 2022. Similar to the FLEX model, Astrolab is leading the design, manufacturing, and testing efforts for FLIP. The company has developed key systems such as the chassis, actuators, avionics, solar panels, communication systems, and flight software.

To tackle the extreme environment of the lunar South Pole, the rover relies on three core technologies, also present in the FLEX model:

  • Proprietary materials that function under cryogenic conditions.
  • Hyper-deformable wheels designed for rough lunar terrain.
  • High-performance batteries capable of withstanding extreme temperatures.

These critical components and testing processes are being developed at Venturi Space’s facilities located in Monaco, Switzerland, France, and the United States. Astrolab will oversee integrated testing and operational management from its California headquarters.


A Step Forward in Astrolab’s Development Strategy

The introduction of this rover aligns with Astrolab’s spiral development approach, which focuses on iterative design-build-test-fly cycles. This strategy allows the company to improve capabilities over time by incorporating insights from testing and flight missions.


Specifications and Market Compatibility

Weighing half a ton and supporting 30 kg of payload, the FLIP rover is built to operate with medium-class lunar landers—a rapidly growing segment of the commercial space industry. The vehicle is designed to enable customers to perform technology demonstrations, conduct scientific exploration, and collect critical lunar data.

FLIP’s design also maintains compatibility with the core systems used by the FLEX rover, ensuring consistency across missions. This modular approach gives customers flexibility and allows for the seamless integration of payloads.


Endurance for Extreme Lunar Conditions

Venturi Space’s experience in developing high-performance electric vehicles has played a crucial role in creating solutions that can handle the challenging lunar environment.

“For the past 25 years, we’ve pioneered the development of electric vehicles, and that expertise now positions us to offer effective mobility solutions for the Moon,” said Gildo Pastor, President of Venturi Space & Venturi. “Our batteries and hyper-deformable wheels can survive some of the most extreme conditions imaginable—ranging from temperature swings of over 300°C to 180-hour lunar nights with temperatures as low as -180°C. Saying I’m proud of our team’s achievements is an understatement.”


Astrolab’s Vision for Lunar Logistics

The new rover is part of Astrolab’s vision to set a new standard for lunar logistics. Just as standardized shipping containers revolutionized intermodal transport on Earth, the company aims to do the same for the Moon.

“This rover provides many of the same payload configurations as our larger FLEX rover, which we’ll be deploying on our Mission One commercial mission,” explained Jaret Matthews, founder and CEO of Astrolab. “When we introduced FLEX in 2022, we set out to establish a logistical standard for lunar operations. FLIP is the next step in that journey, offering customers flexible access to the Moon’s surface for exploration and technology deployment.”


On Display at the International Astronautical Congress

The prototype of the FLIP rover will remain on display at Venturi Space’s booth (MN-A05) at the International Astronautical Congress until the event concludes on October 18.


Conclusion

The collaboration between Venturi Space and Astrolab reflects the growing demand for modular, flexible solutions for lunar exploration. Through FLIP, both companies aim to deliver a rover capable of supporting scientific, technological, and commercial missions on the Moon. Leveraging Venturi Space’s expertise in extreme-condition mobility and Astrolab’s focus on innovative rover design and logistics, this new lunar rover promises to play a pivotal role in the future of lunar exploration.


FAQs

1. What is the purpose of the FLIP rover?
The FLIP rover is designed to provide flexible, multi-purpose payload solutions for scientific, institutional, and commercial users looking to access the Moon’s surface.

2. How does FLIP differ from Astrolab’s FLEX rover?
While both rovers share core technologies, FLIP is tailored to support smaller payloads and operate with medium-class lunar landers. It retains many features of FLEX, such as modular systems and rugged construction.

3. What technologies allow the rover to survive on the Moon?
FLIP is equipped with cryogenic-compatible materials, hyper-deformable wheels, and batteries capable of handling extreme temperature variations and long lunar nights.

4. Where is the rover being developed and tested?
Venturi Space is handling the development of core components at its facilities in Monaco, Switzerland, France, and the U.S. Astrolab is leading integrated testing and operational management from California.

5. When and where can I see the FLIP rover?
The prototype of the FLIP rover is on display at Venturi Space’s booth (MN-A05) at the International Astronautical Congress, which runs until October 18.

Pasternack Expands RG Cable Assembly Portfolio with New High-Performance Options

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Pasternack, a brand under Infinite Electronics and a leading supplier of RF, microwave, and millimeter-wave components, has unveiled a new range of RG cable assemblies. This product line expands Pasternack’s already extensive offerings, providing solutions that meet the demands of various industries and specialized applications.

The newly introduced assemblies include both 50-ohm and 75-ohm configurations, ensuring superior signal transmission for a wide range of uses. These additions are designed to accommodate customization needs across commercial and military sectors, offering performance and reliability for critical RF systems.


Extensive Range of RG Cable Options

Pasternack’s 50-ohm assemblies feature several popular cable types, including:

  • RG58
  • RG141
  • RG142
  • RG174
  • RG178
  • RG179
  • RG223
  • RG316
  • RG393

In addition, Pasternack offers 75-ohm options featuring:

  • RG6
  • RG11
  • RG59B
  • RG62A
  • RG179B
  • RG187A

With these options, customers can select cables that suit their specific needs, whether for high-frequency data transmission or applications that require superior signal integrity.


Versatile Connector and Configuration Options

Pasternack’s new RG cable assemblies offer a wide selection of connector types, including:

  • MCX, MMCX
  • SMA, SMB
  • BNC, TNC
  • N, HN
  • Fakra
  • SHV, MHV

To further enhance flexibility, these connectors are available in multiple orientations, such as straight, right-angle, standard, and reverse-polarity designs. This level of customization ensures that customers can find the exact configuration required for their systems.


Custom Lengths and Tailored Solutions

In addition to various connector types, Pasternack allows customers to choose from standard or customized cable lengths. This capability provides greater adaptability, making it easier to integrate the assemblies into a wide range of RF systems. Whether customers require off-the-shelf lengths or bespoke configurations, Pasternack offers tailored solutions to meet the specific demands of their projects.


Designed for Reliability and High Performance

“Our new cable assemblies built with RG cables provide reliable, high-performance solutions for both commercial and military applications,” said Amar Ganwani, Senior Product Line Manager at Pasternack. “They deliver the durability, flexibility, and signal integrity that our customers rely on for their most critical systems.”

These assemblies are designed to maintain performance across harsh environments, ensuring consistent signal transmission in even the most demanding conditions. This makes them suitable for a variety of applications, including aerospace, telecommunications, defense, and industrial sectors.


Available for Immediate Shipment

Pasternack’s new RG cable assemblies are in stock and ready for same-day shipping, ensuring rapid delivery for time-sensitive projects. With quick fulfillment options, customers can minimize downtime and keep their operations running smoothly.

For inquiries or more information, customers can reach Pasternack at +1 (949) 261-1920 or visit: click here


Conclusion

Pasternack’s new line of RG cable assemblies offers a comprehensive selection of customizable, high-performance solutions. With a variety of cable types, connector configurations, and length options, these assemblies are designed to meet the unique demands of both commercial and military applications. The company’s commitment to quality and fast delivery makes Pasternack a reliable partner for RF engineers seeking robust, tailored solutions for their most critical systems.


FAQs

1. What industries benefit from Pasternack’s RG cable assemblies?
These cable assemblies are suitable for various industries, including aerospace, defense, telecommunications, and industrial applications.

2. What are the available connector types?
Pasternack offers several connector types, including SMA, BNC, TNC, MCX, MMCX, Fakra, SHV, MHV, and more, with options for straight, right-angle, and reverse-polarity configurations.

3. Can I order custom cable lengths?
Yes, Pasternack provides both standard and custom cable lengths, ensuring customers get precisely what they need for their applications.

4. What is the difference between 50-ohm and 75-ohm cables?
50-ohm cables are typically used for high-frequency RF applications, while 75-ohm cables are more common in broadcasting and video applications.

5. How quickly can I receive the products?
Pasternack’s RG cable assemblies are in stock and available for same-day shipping, ensuring fast delivery for urgent projects.

Würth Elektronik ICS to Showcase Innovations at Electronica 2024

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Würth Elektronik ICS will be presenting their latest product innovations at Electronica 2024, which runs from November 12 to 15 at the Munich Trade Fair. The company will spotlight its lead-free high-current contacts for PCB connections, with a special focus on LF PowerPlus 2.0 and LF PowerBasket. Attendees can find Würth Elektronik at stand 334 in hall A2. In addition to these advanced connectors, the company will also unveil PowerBusbars, which are customized copper busbars designed for easy installation and enhanced electrical performance.

As the inventor of Powerelements for PCB connectivity, Würth Elektronik ICS will demonstrate its cutting-edge solutions for high-voltage component contact on PCBs in various industries.


LF PowerBasket: Efficient, Pluggable High-Current Contacts

The LF PowerBasket stands out thanks to its innovative design, featuring contact springs that form a basket-like structure to securely accommodate round contact pins. This unique design allows for multiple mating cycles with minimal insertion force. Additionally, the 0.6 mm positioning tolerance makes these contacts ideal for applications where multiple connections are needed on the same PCB.

The PowerBasket provides reversible pluggable connections, making it perfect for components that require periodic disconnection, such as during maintenance. A typical use case is the connection of a three-phase motor like those found in e-bikes.

The LF PowerBasket is compatible with several assembly technologies, including:

  • Press-fit technology
  • Surface-mount technology (SMT)
  • Through-hole technology (THT)

LF PowerPlus 2.0: Optimized for High-Performance Connections

Another product highlight is the LF PowerPlus 2.0 Powerelement, a high-current contact featuring a brass base and a stainless-steel screw component. This combination offers both high torque and lightweight performance.

The product’s newly developed screw tip facilitates easy alignment of the nut during installation, ensuring compatibility with automated assembly processes. Thanks to its dual-side design, the Powerelement can be mounted on both sides of a PCB, maximizing design flexibility. Depending on the specific configuration, the LF PowerPlus 2.0 is capable of handling currents up to 360 amps.


Introducing PowerBusbars: Custom Copper Busbars for Enhanced PCB Performance

Würth Elektronik ICS is also introducing its PowerBusbar PCB solution, an innovative approach to increasing current-carrying capacity on circuit boards. These custom copper busbars are mounted directly onto PCBs, eliminating the need for additional copper inlays within the boards.

Due to copper’s high thermal conductivity, the PowerBusbars help dissipate heat across the system, reducing the risk of hotspots and improving overall system reliability. These features ensure that PowerBusbars support high-performance applications without sacrificing space or efficiency. Installation is straightforward since the busbars are integrated with Würth Elektronik’s Powerelements in a single step, removing the need for extra fasteners or conductor rails.


Advantages of PowerBusbar Technology on PCBs

  • Improved thermal management: Copper busbars efficiently disperse heat, preventing hotspots.
  • Increased reliability: Higher current capacity enhances overall system performance.
  • Simplified installation: PowerBusbars and Powerelements are mounted together in a single process.
  • Space-saving design: Eliminates the need for bulky copper inlays on PCBs.

Explore Würth Elektronik ICS Products with the Sample Kit

Visitors to the Würth Elektronik ICS booth at electronica 2024 will have the opportunity to explore a range of products through a special sample kit. This curated kit offers a comprehensive selection of Powerelements, showcasing the versatility and potential applications of lead-free high-current contacts. The sample kit provides developers with a practical way to evaluate various solutions for their specific projects.

The sample kits will be available at the exhibition booth, and those unable to attend can also request them online. This makes it easy for engineers and designers to experience the benefits of Würth Elektronik ICS products first-hand, whether at the event or from their own offices.


Meet Würth Elektronik ICS at Electronica 2024

With its focus on lead-free solutions and innovative power elements, Würth Elektronik ICS aims to set new standards in high-current PCB connectivity. The company’s commitment to sustainability and performance is evident through the introduction of advanced products like LF PowerPlus 2.0, LF PowerBasket, and PowerBusbars. Whether you’re looking for efficient power solutions for e-mobility, industrial electronics, or other applications, Würth Elektronik ICS offers cutting-edge technology designed to meet the most demanding requirements.

Be sure to visit stand 334 in hall A2 at electronica 2024 from November 12 to 15, 2024, and discover how Würth Elektronik ICS is revolutionizing PCB connectivity.

For further information, visit their website at www.we-online.com/ics.


Conclusion

Würth Elektronik ICS continues to push the boundaries of PCB connectivity with their lead-free Powerelements and custom busbar solutions. Their product offerings, showcased at electronica 2024, highlight the company’s commitment to providing innovative and sustainable electrical components for a variety of industries. Whether it’s e-bikes, high-performance systems, or industrial electronics, Würth Elektronik ICS delivers high-current solutions that enhance efficiency and reliability.


FAQs

1. What is the LF PowerBasket used for?
The LF PowerBasket is ideal for applications requiring multiple connections, such as three-phase motors in e-bikes. It provides a reversible pluggable connection with low insertion force, making it easy to maintain and disconnect components.

2. What advantages does the LF PowerPlus 2.0 offer?
LF PowerPlus 2.0 features a lightweight design with a brass base and stainless-steel screw component, offering high torque and easy automated assembly. It can handle currents up to 360 amps, depending on the configuration.

3. How does PowerBusbar PCB technology improve performance?
PowerBusbars enhance current-carrying capacity and improve heat dissipation, preventing hotspots and boosting reliability. They also eliminate the need for additional copper inlays on PCBs.

4. Can I get samples of Würth Elektronik ICS products?
Yes, Würth Elektronik ICS offers a sample kit with selected Powerelements at electronica 2024. These kits can also be ordered online for those who cannot attend the event.

5. Where can I find Würth Elektronik ICS at electronica 2024?
You can visit Würth Elektronik ICS at stand 334 in hall A2 at the Munich trade fair, from November 12 to 15, 2024.

Bransys Group Expands Manufacturing Capabilities with Addition of Two REHM VisionXP+ Nitro Reflow Ovens

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Bransys Group, a leading provider of PCB design and assembly services, has announced the installation of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens at its advanced manufacturing facility. This expansion aims to accommodate growing demand, enhance production quality, and strengthen Bransys’ position as an industry leader in electronics manufacturing.


A Step Towards Enhanced Quality and Sustainability

The REHM VisionXP+ Nitro 3850 ovens are regarded as one of the top-performing convection soldering systems in the market. Known for their energy-efficient operation, high performance, and eco-friendly design, these reflow ovens will allow Bransys to deliver superior soldering results with greater precision.

Each VisionXP+ oven comes equipped with 8 preheat zones, 3 peak zones, and 4 cooling zones, providing exceptional thermal control. This design ensures optimal soldering quality, even for complex PCB assemblies, while maintaining product integrity.


Bransys Group Expands Manufacturing Capabilities with Addition of Two REHM VisionXP+ Nitro Reflow Ovens

Sustainable Manufacturing with VisionXP+ Technology

One of the core advantages of the VisionXP+ series is its focus on sustainable resource management. By integrating EC motors, these ovens minimize energy consumption and reduce operational costs. This aligns perfectly with Bransys Group’s commitment to environmentally responsible manufacturing.

The ovens also incorporate innovative nitrogen and heat transfer technologies that lower emissions, supporting the company’s objective of promoting sustainable manufacturing in the electronics industry.


Key Features of the REHM VisionXP+ Reflow Ovens

The REHM VisionXP+ Nitro 3850 reflow ovens come with advanced features designed to improve manufacturing efficiency and performance:

  • Vacuum Soldering Option: Ensures fast, reliable production while reducing voids, helping to maintain high-quality solder joints.
  • Gentle Cooling Systems: Offers several cooling options, including underside cooling, to accommodate high-mass boards without compromising product integrity.
  • Energy-Efficient Design: Proven energy savings through EC motor technology reduce operational costs while supporting Bransys’ sustainability goals.

Strengthening Bransys Group’s Commitment to Innovation and Quality

Bransys Group is committed to delivering top-tier PCB design and assembly solutions by leveraging cutting-edge technology and industry expertise. The addition of the REHM VisionXP+ Nitro reflow ovens reflects the company’s ongoing focus on quality, efficiency, and sustainability, ensuring they meet the evolving needs of their customers.

By continuously enhancing its manufacturing capabilities, Bransys aims to exceed client expectations and provide innovative solutions that drive long-term success.


For More Information

For further details about Bransys Group and its services, please visit www.bransys.com.