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Leadership Summit 2024: Embracing Industry 5.0 and AI-Powered Innovation

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Leadership Summit 2024: As the global transition to Industry 5.0 accelerates—where human creativity integrates with Artificial Intelligence (AI) to revolutionize businesses and drive innovation—BML Munjal University (BMU) is gearing up to host its 5th Leadership Summit. The event, set to take place on October 4, 2024, in partnership with the NHRDN Rewari Alwar Chapter, will explore the theme “Embracing Industry 5.0: Leading the AI-Powered Organisations.” The summit will bring together industry leaders, decision-makers, and visionaries to discuss how AI, including Generative AI, is transforming industries, fostering innovation, and enabling sustainable growth.

Leadership Summit Highlights

The event will begin with a welcome address by Prof. Shyam Menon, Vice-Chancellor of BMU, followed by Prof. Pratik Modi, Dean of the School of Management, who will introduce the event’s context. Mr. Sunil Kant Munjal, Chancellor of BMU and Chairman of Hero Enterprise, will deliver the inaugural address, focusing on the essential role of leadership in navigating the complexities of this transformative era. Ms. Swati Munjal, President of BMU, will then give a plenary address on the integration of human creativity and AI-driven innovation in leadership.

A keynote address by Ms. Vinita Bali, Former CEO of Britannia Industries, will provide further insights into how AI is reshaping industries and driving transformative change.

Plenary Sessions and Discussions

The summit will feature three plenary sessions, each addressing key aspects of Industry 5.0 and AI-powered transformation:

  1. Human-AI Collaboration in Industry 5.0
    Distinguished speakers, including Mr. Nikhil Malhotra (Chief Innovation Officer, Tech Mahindra), Mr. Ravindra Sharma (Chief of Brand, Corporate Communications & CSR, SBI Life Insurance Co. Ltd.), Ms. Nishu Jain (Executive Director, Data & Analytics, PwC), and Mr. Venkatesh Raman Prasad (JSA Legal Firm), will discuss strategies for seamless collaboration between human workers and AI systems. This session will focus on improving productivity and driving innovation through the integration of AI and human creativity.
  2. AI-Driven Innovations and Disruptions
    This session will feature insights from experts such as Mr. Nilanjan Chakravortty (GM-R&D, Hitachi), Mr. Saurav Bhaik (Founder & CEO, Tagbin & Stylin), and Mr. Nitin Kalra (Founder & CEO, Blu Parrot). They will explore how AI is driving innovation and disrupting traditional business models across various sectors, including healthcare, finance, media, automotive, and agriculture.
  3. Ethical and Sociological Implications of AI
    The third session will address the ethical challenges surrounding AI adoption, including concerns about bias, privacy, and the role of leadership in ensuring responsible AI deployment. Speakers, including Ms. Rachna Kumar (CHRO, Hero MotoCorp) and Ms. Lopamudra Banerjee (CHRO, Carrier Midea), will discuss how businesses can maintain ethical standards in an AI-driven workplace.

Insights from BMU Leadership

Prof. Pratik Modi, Dean of the School of Management at BML Munjal University, highlighted the event’s significance, stating, “Industry 5.0 is about merging human ingenuity with AI to unlock new levels of innovation.” The 5th Leadership Summit, an annual flagship event of BMU, aims to foster dialogue between industry leaders, academia, and students on the future of AI-powered growth.

Summit Chair Dr. Richa Mishra and Co-Chair Dr. Jolly Masih emphasized the importance of collaboration, noting that “Fostering partnerships between industry, academia, and students is essential for driving AI-powered innovation and growth.”

Conclusion

BML Munjal University’s 5th Leadership Summit 2024 promises to be a pivotal event, exploring the dynamic intersection of human creativity and AI in Industry 5.0. As businesses and industries move toward AI-powered transformation, the summit will provide valuable insights on leading organizations through this new era of innovation and growth.

STMicroelectronics Introduces Fourth-Generation Silicon Carbide Technology to Drive Innovation in Electric Vehicles and Industrial Applications

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STMicroelectronics, a global leader in semiconductors serving a wide range of electronics applications, has unveiled its fourth-generation STPOWER Silicon Carbide (SiC) MOSFET technology. This new generation sets benchmarks in power efficiency, density, and robustness, specifically optimized for traction inverters—crucial components of electric vehicle (EV) powertrains. While serving both automotive and industrial markets, the company is committed to advancing SiC technology with multiple innovations planned through 2027.

Driving the Future of Electric Mobility and Industrial Efficiency

“STMicroelectronics is committed to shaping the future of electric mobility and industrial efficiency with our state-of-the-art silicon carbide technology,” said Marco Cassis, President of the Analog, Power & Discrete, MEMS, and Sensors Group at STMicroelectronics. “Our continued advancements in SiC MOSFET technology, together with innovations in advanced packaging and power modules, are delivering industry-leading SiC performance and supply chain resilience. This commitment meets the growing needs of our customers and supports a more sustainable future.”

SiC Technology: The Key to High Efficiency and Power Density

As the market leader in SiC power MOSFETs, STMicroelectronics is driving innovation to leverage SiC’s advantages over traditional silicon devices, offering higher efficiency and greater power density. The fourth-generation SiC devices are designed to meet the requirements of next-generation EV traction inverter platforms, with significant advances in size and energy-saving potential. The EV market, while growing rapidly, still faces challenges to achieve widespread adoption, particularly in creating more affordable vehicles.

SiC-based 800V EV bus drive systems have enabled faster charging and reduced vehicle weight, giving premium models longer driving ranges. ST’s new SiC MOSFET devices, available in 750V and 1200V classes, will improve the energy efficiency and performance of both 400V and 800V EV traction inverters, bringing these benefits to mid-size and compact EVs. This is key to achieving mass market adoption of electric vehicles. Beyond EVs, the new generation of SiC technology is ideal for high-power industrial applications, including solar inverters, energy storage systems, and datacenters, delivering significant energy efficiency improvements.

Availability Timeline

STMicroelectronics has completed the qualification of its 750V SiC technology platform and expects to finalize qualification of the 1200V class by the first quarter of 2025. Following this, commercial availability of devices with nominal voltage ratings of 750V and 1200V will enable designers to develop applications ranging from standard AC-line voltages to high-voltage EV batteries and chargers.

Applications and Use Cases

ST’s Generation 4 SiC MOSFETs offer enhanced efficiency, smaller components, reduced weight, and extended driving ranges compared to traditional silicon solutions. These features are essential for encouraging the widespread adoption of electric vehicles. Leading EV manufacturers are actively collaborating with ST to integrate Generation 4 SiC technology into their vehicles, aiming to improve both performance and energy efficiency.

While traction inverters in EVs are the primary application, the fourth-generation SiC MOSFETs are also suitable for high-power industrial motor drives. These devices enhance switching performance and robustness, resulting in more efficient and reliable motor control, reducing energy consumption and operating costs. In renewable energy applications, the technology increases the efficiency of solar inverters and energy storage systems, contributing to more sustainable and cost-effective energy solutions. Additionally, SiC MOSFETs can be employed in datacenter power supplies, where their high efficiency and compact size are essential for addressing the significant power demands and thermal management challenges associated with AI-driven workloads.

Roadmap for SiC Innovation

STMicroelectronics is accelerating the development of SiC power devices through its vertically integrated manufacturing strategy, working on multiple SiC technology innovations in parallel to advance power device technologies over the next three years. The upcoming fifth generation of ST’s SiC power devices will introduce high-power density technology based on a planar structure. Additionally, the company is working on a radical innovation that promises exceptional on-resistance (RDS(on)) values at high temperatures, significantly reducing RDS(on) compared to existing SiC technologies.

Upcoming Industry Event

STMicroelectronics will participate in ICSCRM 2024, the leading annual conference focused on the latest achievements in SiC and other wide bandgap semiconductors. The event, taking place from September 29 to October 4, 2024, in Raleigh, North Carolina, will feature ST’s technical presentations and an industrial keynote on the “High volume industrial environment for leading-edge technologies in SiC.”

For more details, visit: ICSCRM 2024 – STMicroelectronics.

ST’s ongoing advancements in SiC technology highlight its commitment to driving innovation in both electric mobility and industrial applications, contributing to a more energy-efficient and sustainable future.

HCLTech Releases ‘Cloud Evolution: Mandate to Modernize’ Report, Highlighting Cloud’s Role in Enterprise Innovation

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HCLTech, a global leader in technology, has released its latest report, ‘Cloud Evolution: Mandate to Modernize,’ providing an in-depth analysis of how businesses are reshaping their cloud strategies to drive innovation and transformation. The report outlines the critical role of cloud technologies, generative AI (GenAI), and cloud-native practices in modernizing enterprises.

“Cloud is no longer just a technology investment; it’s central to how businesses evolve,” said Siki Giunta, Executive Vice President and Head of Cloud Native Center of Excellence at HCLTech. “The convergence of cloud, GenAI, and cloud-native practices empowers enterprises to make quicker decisions, enhance customer experiences, and gain a competitive edge. By adopting cloud-native architectures and platform engineering, companies can future-proof their IT infrastructures, ensuring scalability, agility, and resilience.”

Key Findings from the Report

Hybrid and Multicloud Strategies Dominate

  • Enterprises are 2.2x more likely to have a dedicated multicloud strategy now compared to three years ago.
  • 87% of organizations use more than one cloud provider, typically relying on three for their multicloud strategies. This shows the growing importance of flexibility and redundancy in cloud infrastructures.
  • 85% of enterprises plan to expand partnerships with additional cloud providers within the next year. Despite increased public cloud adoption, 81% of companies still maintain significant on-premises infrastructure for data security and regulatory reasons, emphasizing the need for hybrid cloud strategies.

Application Modernization: A Priority for Cloud Success

  • 80% of enterprises agree that the true value of public cloud is only realized when applications are modernized during migration, rather than merely being “lifted and shifted.”
  • 73% of organizations are actively refactoring applications during cloud migration, indicating a shift toward cloud-native modernization.
  • 78% believe cloud-native practices improve overall performance and efficiency.

Generative AI (GenAI) Driving Cloud Adoption

  • 98% of enterprises are exploring custom GenAI solutions on the cloud, utilizing cloud-native practices to modernize applications.
  • 55% of organizations noted that data for GenAI solutions often resides on-premises, prompting them to run some GenAI solutions in-house before scaling them to the cloud.

The Value of Third-Party Consulting

  • 83% of enterprises that partner with third-party consultants report significant improvements in IT efficiency and application performance, showcasing the importance of expert guidance for cloud strategy success.

Expert Insights

Rampal Singh, Vice President and Global Business Head of Hybrid Cloud at HCLTech, stressed the importance of seamless IT operations across cloud environments. “Enterprises that invest in open solutions can mitigate the complexities of multicloud setups. The findings of our study emphasize that cloud must be seen as the foundational platform for deploying AI-driven solutions that will shape the future of industries.”

HCLTech’s CloudSMART strategy is designed to help enterprises unlock tangible business outcomes from cloud investments. With its deep engineering expertise and partnerships with leading cloud providers, HCLTech helps businesses adopt modern cloud practices and ensure continuous modernization.

HCLTech’s AI & Cloud Native Labs offer a hands-on, consultative approach to help businesses modernize through cloud transformation. These labs leverage cutting-edge software engineering techniques to future-proof enterprises, all in a fully equipped lab environment.

Research Methodology

The report is based on a survey conducted by ESG, a global analyst firm, on behalf of HCLTech. It includes insights from 500 senior business and technology leaders across multiple industries and regions, offering a comprehensive view of how enterprises are leveraging cloud technologies to drive innovation and efficiency.

Microwave Communication Equipment Market: Rising Demand for High-Speed Data Transmission Across Sectors

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The microwave communication equipment market is experiencing substantial growth, driven by the increasing need for high-capacity, high-speed data transmission across industries such as telecommunications, broadcasting, and satellite communications. Microwave technology offers several advantages, including efficient long-distance communication and minimal signal degradation, making it ideal for backbone infrastructure and mobile networks. Key market drivers include the expansion of 5G networks, the rise of IoT applications, and the need for reliable communication solutions in remote areas. To meet evolving customer needs, major players are investing in advanced equipment like microwave transmitters, receivers, and amplifiers. With continuous technological advancements and global connectivity initiatives, the market is poised for further expansion.


Market Overview

The microwave communication equipment market is steadily growing, fueled by increasing demand for high-speed data transmission and advancements in wireless communication technologies. This market includes a variety of products, such as microwave antennas, transmitters, receivers, and amplifiers, used in sectors like telecommunications, broadcasting, and satellite communications. The rise of 5G networks and the growing need for broadband connectivity are encouraging greater investments in microwave technology. Leading companies are focusing on innovation and developing integrated solutions to improve performance, ensuring the market’s continued growth and evolution.


Key Market Players

Several major companies dominate the microwave communication equipment market, offering a wide range of products and services across various industries. The top players in the market include:

  • NEC
  • Ericsson
  • Nokia
  • Alcatel-Lucent
  • Huawei
  • ZTE
  • Samsung
  • Fujitsu
  • Hitachi
  • Rohde & Schwarz
  • Keysight Technologies
  • Anritsu
  • Viavi Solutions
  • Spirent Communications
  • B Precision

Competition in the market is intense, with both established companies and emerging players vying for market share. Industry leaders like Cisco Systems, Huawei Technologies, Ericsson, Nokia, and Samsung dominate the landscape by offering a broad range of products and services. These companies invest heavily in research and development to enhance their product offerings and expand their customer base through strategic partnerships, mergers, and acquisitions.


Innovation and Emerging Competitors

The microwave communication equipment market is witnessing healthy growth, driven by the entry of new players offering innovative solutions at competitive prices. Emerging companies are focusing on technological advancements to develop microwave communication equipment that is high-performance or unique. The competitive nature of the market is expected to continue, with more new players entering the scene and larger firms acquiring smaller, innovative companies.


Cisco Systems: A Market Leader

Cisco Systems, headquartered in San Jose, California, is one of the leading providers of microwave communication equipment. The company offers an extensive product lineup for a wide range of applications, including enterprise networking, service provider networks, and industrial IoT. With a strong global presence and a diverse customer base, Cisco Systems is a key player in product innovation and network management solutions.


Market Segmentation

The microwave communication equipment market is segmented based on product type, application, and region. By type, the market includes microwave antennas, transmitters, receivers, amplifiers, and satellite communication equipment. By application, the market is divided into sectors such as:

  • Telecommunications
  • Broadcasting
  • Military and Defense
  • Satellite Communications
  • Others

Geographically, the market covers North America, Europe, Asia-Pacific, Latin America, and the Middle East & Africa. Asia-Pacific is expected to experience the fastest growth due to increasing demand for high-speed connectivity and infrastructure development in countries like China and India. Each region presents unique opportunities and challenges, influenced by technological advancements and regional market dynamics.


Market Dynamics

The microwave communication equipment market is shaped by several key factors:

  • Drivers: The growing demand for high-speed internet, the expansion of 5G networks, and increasing reliance on satellite communication for various applications are driving market growth.
  • Challenges: High installation and maintenance costs, as well as regulatory hurdles, can impede growth in certain regions.
  • Opportunities: Rapid technological advancements are creating opportunities for manufacturers to innovate and reduce costs. The integration of IoT devices and the push for efficient bandwidth utilization are major trends shaping the market.

Recent Developments

Recent advancements in the microwave communication equipment market are focused on improving data transmission speeds and reliability. Key players are investing in the development of innovative products, such as high-capacity microwave links to support 5G infrastructure and advanced beamforming antennas for improved signal quality. There is also a growing trend of integrating artificial intelligence (AI) and machine learning (ML) to optimize network performance and maintenance. Additionally, partnerships and collaborations among industry leaders are increasing, leveraging complementary strengths to accelerate product development. These trends highlight the industry’s commitment to meeting the evolving needs of telecommunications and other sectors reliant on efficient communication systems.


Regional Analysis

The regional analysis of the microwave communication equipment market reveals distinct growth patterns:

  • North America: Holds a significant market share due to the presence of major telecommunications companies and early adoption of 5G technology.
  • Europe: Benefiting from advancements in satellite communication and government investments in broadband infrastructure.
  • Asia-Pacific: Anticipated to witness the fastest growth, driven by rising smartphone usage, urbanization, and the need for high-speed internet in countries like China and India.
  • Latin America and the Middle East & Africa: Gradually evolving markets with growing investments in infrastructure and efforts to improve communication networks, particularly in remote and underserved regions.

Conclusion

The microwave communication equipment market is on a strong growth trajectory, fueled by increasing demand for high-speed data transmission, the expansion of 5G networks, and the rise of IoT applications. Despite challenges such as high installation costs and regulatory barriers, the market offers numerous opportunities for innovation and expansion. Major companies are focusing on developing advanced equipment and forming strategic partnerships to stay competitive. As technological advancements continue and global connectivity initiatives progress, the market is set for continued expansion, offering solutions that will meet the evolving needs of various sectors reliant on reliable and efficient communication systems.

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Access Control as a Service (ACaaS): The Future of Cloud-Based Security Solutions

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Access Control as a Service (ACaaS) is quickly becoming the preferred solution for businesses to manage the entry and exit of individuals into their physical properties. In the past, access control systems required on-site machines and complex software installations, which made them expensive and difficult to maintain. However, with the advent of ACaaS, access control is now hosted in the cloud, providing a flexible, scalable, and cost-effective approach to security management.

According to Consegic Business Intelligence, the global Access Control as a Service market size is expected to grow significantly, reaching over USD 3,734.47 million by 2031, up from USD 1,245.04 million in 2023. It is projected to grow by USD 1,406.10 million in 2024 alone, with a compound annual growth rate (CAGR) of 14.7% from 2024 to 2031. This rapid growth reflects the increasing demand for ACaaS, which enables businesses to modernize their access control systems without the need for physical security personnel on-site.


Why ACaaS is Transforming Access Control

The shift to ACaaS has brought several advantages over traditional access control systems, making it a popular choice for organizations of all sizes. By leveraging cloud technology, businesses gain access to a centrally managed security system that offers real-time monitoring and seamless integration with other security solutions. ACaaS is designed to simplify security operations, providing organizations with the tools to manage access from any location at any time, whether through a mobile app or a web portal.

One of the primary benefits of ACaaS is its subscription-based model, which reduces upfront costs. Businesses no longer need to invest heavily in expensive hardware or software. Instead, they pay for the service based on usage, making pricing more predictable and affordable. This model also allows for scalability, enabling businesses to easily add or remove locations and users as their needs change.


Key Benefits of Access Control as a Service (ACaaS)

  1. Cost-Effective and Predictable Pricing:
    ACaaS eliminates the need for large capital investments in hardware and software. Businesses pay for the service on a subscription basis, which makes pricing transparent and predictable.
  2. Scalability:
    As businesses grow, their access control needs may change. ACaaS allows for easy scaling, making it ideal for companies with multiple offices or remote locations. Whether expanding or downsizing, ACaaS can adjust to meet the organization’s evolving needs.
  3. Remote Access and Flexibility:
    Administrators can manage access control from anywhere using a mobile application or web portal. This flexibility is especially valuable for off-site managers, who can modify access permissions in real time and monitor activity remotely.
  4. Real-Time Monitoring and Alerts:
    ACaaS systems are programmable to monitor access events continuously. If unauthorized access attempts occur, the system can send instant alerts, allowing security teams to respond immediately to potential threats.
  5. Automatic Updates and Security Patches:
    Cloud-based systems are updated automatically with the latest security patches, ensuring that businesses are protected against emerging cyber threats without needing to manually apply updates.
  6. Comprehensive Security Integration:
    ACaaS can be integrated with other cloud-based security solutions, such as video surveillance and visitor management systems. This creates a comprehensive security environment that covers all aspects of access control and monitoring.

Challenges in Adopting ACaaS

While ACaaS offers numerous advantages, there are also challenges that businesses must consider before adopting this cloud-based solution.

  1. Data Privacy and Compliance:
    Storing access control data in the cloud raises concerns about data privacy and regulatory compliance. Organizations need to ensure that their ACaaS provider complies with relevant legal standards, such as the General Data Protection Regulation (GDPR) in Europe or the Health Insurance Portability and Accountability Act (HIPAA) in the U.S.
  2. Internet Connectivity:
    Since ACaaS relies on cloud technology, a fast, stable, and secure internet connection is essential for its operation. Network interruptions can affect the system’s ability to manage access control effectively.
  3. Cybersecurity Risks:
    Like any cloud-based solution, ACaaS is vulnerable to hacking attempts. Businesses must implement robust security measures, such as encryption, multi-factor authentication, and regular security audits, to protect their systems from breaches.

The Growing Popularity of ACaaS Despite Challenges

Despite concerns around data privacy, internet connectivity, and cybersecurity risks, ACaaS continues to grow in popularity. Its flexibility, scalability, and cost savings make it an attractive option for companies looking to modernize their access control strategies. By offering real-time monitoring, automated updates, and seamless integration with other security systems, ACaaS delivers an end-to-end security solution that can adapt to the needs of modern businesses.


Conclusion

Access Control as a Service (ACaaS) is revolutionizing the way businesses manage security at their physical locations. By leveraging cloud technology, companies gain access to a scalable, flexible, and cost-effective security solution that reduces upfront costs and allows for real-time monitoring and control from anywhere. Despite the challenges of data privacy, network reliability, and cybersecurity, the benefits of ACaaS are clear. With its growing adoption across industries, ACaaS is poised to become the leading solution for access control management in the years to come.


FAQs

  1. What is Access Control as a Service (ACaaS)?
    ACaaS is a cloud-based solution that allows businesses to manage access control remotely. It provides real-time monitoring, flexible access management, and seamless integration with other security systems.
  2. What are the advantages of using ACaaS?
    Key benefits include cost savings through subscription-based pricing, scalability, real-time monitoring, automatic updates, and the ability to manage access from anywhere.
  3. What industries benefit from ACaaS?
    ACaaS is widely used in various industries, including commercial buildings, healthcare, education, and retail, where secure access management is critical.
  4. How does ACaaS ensure data privacy?
    Businesses need to choose ACaaS providers that comply with data protection regulations such as GDPR or HIPAA. Security measures like encryption and multi-factor authentication also help protect sensitive data.
  5. Can ACaaS be integrated with other security systems?
    Yes, ACaaS can be easily integrated with other cloud-based security solutions, such as video surveillance and visitor management, to create a comprehensive security environment.

Source: Access Control as a Service Market 

STMicroelectronics Achieves FIPS 140-3 Certification for STSAFE-TPM Trusted Platform Modules

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STMicroelectronics has introduced a lineup of TPMs that have successfully achieved the FIPS 140-3 certification. These include the following models:

  • ST33KTPM2X
  • ST33KTPM2XSPI
  • ST33KTPM2XI2C
  • ST33KTPM2I
  • ST33KTPM2A

These TPMs provide robust cryptographic asset protection, making them suitable for high-security environments such as PCs, servers, IoT devices, and industrial systems. Whether integrated into automotive systems, medical devices, or critical infrastructure, these modules ensure compliance with the latest security regulations and standards.

FIPS 140-3 Certification: The Latest in Cryptographic Standards

FIPS 140-3 is the most recent iteration of the federal information processing standards for cryptographic modules. It represents a significant advancement over the earlier FIPS 140-2 standard, introducing stronger encryption algorithms, enhanced physical security features, and more rigorous testing protocols.

Laurent Degauque, Marketing Director of Connected Security at STMicroelectronics, emphasized the importance of this certification by stating, “All FIPS 140-2 certificates are scheduled to expire in September 2026. By achieving FIPS 140-3, our TPMs are uniquely ready for new designs and let customers create secure, interoperable equipment with extended product and certification lifetimes.”

Use Cases and Applications of STSAFE-TPM Devices

The certified STSAFE-TPM devices are designed to support a variety of high-security use cases. Key applications include:

  • Secure Boot: Ensures that systems only boot trusted software, protecting against unauthorized modifications.
  • Remote and Anonymous Attestation: Provides the ability to verify the integrity of remote devices without revealing sensitive data.
  • Secure Storage: With an extended user memory of 200kBytes, these TPMs ensure safe storage of critical cryptographic keys and other sensitive information.

Meeting Industry Security Standards

STMicroelectronics’ TPMs are compliant with multiple industry-leading security standards, making them a versatile solution for various sectors. Key certifications and standards include:

  • Trusted Computing Group TPM 2.0: A crucial standard for trusted platform modules that ensures interoperability and security.
  • Common Criteria EAL4+: This certification includes the most stringent vulnerability analysis (AVA_VAN.5), ensuring that these TPMs have passed rigorous testing against potential attacks.
  • FIPS 140-3 Level 1 and Physical Security Level 3: These TPMs provide robust physical security features to safeguard against tampering and physical intrusion attempts.

Enhanced Cryptographic Services for Cutting-Edge Security

The STSAFE-TPM devices offer a wide range of cryptographic services to meet the needs of modern digital environments. These include:

  • Elliptic Curve Digital Signature Algorithm (ECDSA) & Elliptic Curve Diffie-Hellman (ECDH) with key sizes up to 384 bits
  • RSA encryption with key sizes up to 4096 bits, including key generation
  • Advanced Encryption Standard (AES) with key sizes up to 256 bits
  • Secure Hash Algorithms (SHA1, SHA2, and SHA3)

These cryptographic services, standardized by the Trusted Computing Group (TCG), provide the tools needed to secure sensitive data and maintain compliance with FIPS 140-3 standards.

PQC: Preparing for Post-Quantum Cryptography

In addition to these advanced cryptographic services, STMicroelectronics’ TPMs also support secure firmware updates. This functionality ensures that new cryptographic algorithms, such as Post-Quantum Cryptography (PQC), can be added in the future. As quantum computing technology continues to evolve, the ability to update cryptographic algorithms will be crucial in maintaining state-of-the-art cryptographic protection.

ST33KTPM2I: Tailored for Industrial Systems

Among the newly certified devices, the ST33KTPM2I stands out for its suitability in long-lifetime industrial systems. Designed for robust performance in harsh environments, this model is ideal for use in critical infrastructure and industrial IoT applications where reliability and security are paramount.

ST33KTPM2A: Automotive-Ready Security

The ST33KTPM2A, marketed under the name STSAFE-V100-TPM, leverages an AEC-Q100 qualified hardware platform, making it an ideal choice for automotive integration. As the automotive industry moves toward connected and autonomous vehicles, the need for secure communication and data protection becomes even more crucial. This TPM ensures compliance with the stringent security requirements of the automotive sector, providing a trusted solution for securing in-vehicle systems.

Key Advantages of STSAFE-TPM Devices

  1. Extended Product Lifetimes: The FIPS 140-3 certification guarantees that these TPMs will remain compliant with security standards for years to come, allowing customers to build products with long lifecycles.
  2. Reduced Time to Market: With STMicroelectronics offering provisioning services to load device keys and certificates, customers can significantly reduce the time required to bring secure products to market.
  3. Supply Chain Security: By ensuring the security of the supply chain, STMicroelectronics’ provisioning services also help protect against potential vulnerabilities introduced during the manufacturing process.

Provisioning Services for Enhanced Security

STMicroelectronics goes beyond providing TPMs by offering comprehensive provisioning services. These services include the loading of device keys and certificates during manufacturing, reducing the total solution cost and accelerating the time-to-market for new products. This ensures that the cryptographic elements of a product are securely installed, safeguarding the entire supply chain from potential vulnerabilities.

Future-Proofing with Secure Firmware Updates

As mentioned earlier, one of the standout features of STSAFE-TPM devices is their ability to receive secure firmware updates. This allows for the seamless integration of new cryptographic algorithms and security features as they become available, ensuring that the devices remain secure and up-to-date over the long term. Whether it’s adding PQC support or introducing new encryption methods, these updates guarantee that your systems will be protected against emerging threats.

Conclusion: A New Era in Cryptographic Security

STMicroelectronics’ achievement of FIPS 140-3 certification for its STSAFE-TPM trusted platform modules marks a significant milestone in cryptographic security. With applications ranging from IoT devices to automotive systems and industrial infrastructure, these TPMs offer the robust protection needed to meet the evolving security landscape. Through their compliance with multiple industry standards, support for advanced cryptographic services, and ability to future-proof through secure firmware updates, these devices provide a versatile, secure, and reliable solution for modern critical information systems.

FAQs

  1. What is FIPS 140-3 certification? FIPS 140-3 is the latest version of the federal information processing standards for cryptographic modules, ensuring robust security features for digital systems.
  2. Which industries can benefit from STSAFE-TPM devices? These TPMs are used in various industries, including automotive, IoT, industrial systems, and medical devices, providing essential cryptographic protection.
  3. What cryptographic services do these TPMs offer? The STSAFE-TPM devices offer ECDSA, ECDH, RSA encryption, AES, and secure hash algorithms (SHA1, SHA2, and SHA3), meeting modern cryptographic standards.
  4. What makes the ST33KTPM2A unique for automotive use? The ST33KTPM2A, also known as STSAFE-V100-TPM, is built on an AEC-Q100 qualified hardware platform, ensuring it meets the stringent requirements of automotive systems.
  5. How does STMicroelectronics ensure the security of the supply chain? Through their provisioning services, STMicroelectronics securely loads device keys and certificates during manufacturing, safeguarding the entire supply chain.

GOEPEL Electronic Expands TAP Interface Card Portfolio with New Modules at Electronica 2024

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GOEPEL electronic is enhancing its Test Access Port (TAP) Interface Card (TIC) lineup with two new modules: the SFX II TIC01/VX plug-in variant and the external add-on SFX II TIC422/S(R). These latest additions will debut at electronica 2024 in Munich and are designed for use with the SFX II CUBE, SFX II BLADE, and SCANBOOSTER II controllers, maintaining compatibility with previous TIC versions.

Maximized Flexibility for Testing, Programming, and Debugging

The SFX II TIC01/VX module can be installed in any available TIC slot in compatible controllers, providing unparalleled flexibility for various applications such as boundary-scan testing (BST), processor-emulation testing (PET), in-system embedded programming, and debugging.

Notably, this module supports a programmable voltage range from 1.65V to 4.5V, ensuring compatibility with 5V signals. Additional features include programmable impedance, programmable input voltage thresholds, and a switch control signal, allowing it to easily adapt to the specific needs of the device under test (DUT).

Versatile Interface for Multiple Debug Protocols

The SFX II TIC422/S(R) module supports a wide variety of serial debug protocols, including JTAG, SWD, BDM, SBW, PIC, HS/CSI, and DAP. With its reconfigurable architecture, the module can extend its protocol support even for modules already installed in test fixtures, providing future-proof versatility.

As GOEPEL’s first external TIC with programmable input and output voltage (1.65V to 4.5V), the SFX II TIC422/S(R) is ideal for managing 5V systems. It serves as the front-end interface for controlling the Unit Under Test (UUT) access port, ensuring reliable bus control, and is fully compatible with previous TIC022/S(R) modules.

Thanks to hardware-based protocol support, there are no delays or additional costs when switching between different UUTs, making it an efficient solution for high-volume production environments.

Additionally, the POD422/S(R) is available for use with GOEPEL’s award-winning FlashFOX stand-alone programmer, complementing the SFX II TIC422/S(R) module for the SCANFLEX controller family. Both are supported by the SYSTEM CASCON platform, utilizing VarioTAP technology to turn processors and microcontrollers into powerful embedded test and programming tools without needing design-specific firmware.

About GOEPEL Electronic

GOEPEL electronic is a leading provider of electrical and optical test, measurement, and inspection equipment for electronic components, printed circuit board assemblies, and industrial and automotive electronics. The company operates across four key business units:

  • Automotive Test Solutions
  • Embedded JTAG Solutions
  • Inspection Solutions (AOI-AXI-SPI-IVS)
  • Industrial Function Test

With a global presence, including subsidiaries and distributors, GOEPEL electronic achieved sales of approximately 40 million euros in 2023 and employs around 240 people. For more information, visit www.goepel.com/en.

LiDAR: Driving the Future of Autonomous Vehicles with Precision and Safety

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LiDAR (Light Detection and Ranging) technology has emerged as the cornerstone for the advancement of autonomous vehicles (AVs). Renowned for its unmatched precision in navigation and safety, LiDAR enables self-driving cars to perceive and interpret their surroundings in real-time. By utilizing laser pulses to map environments, LiDAR allows AVs to navigate roads, detect obstacles, and make informed decisions. As the autonomous vehicle market expands, the role of LiDAR in enhancing the safety and reliability of these systems becomes even more significant. According to Consegic Business Intelligence, the LiDAR market is projected to reach over USD 11.77 billion by 2031, growing at a CAGR of 19.1% from 2024 to 2031.

Accurate 3D Mapping and Environmental Perception

LiDAR operates by sending laser pulses that bounce back to a detector, creating highly accurate 3D maps of the vehicle’s surroundings. These maps provide crucial spatial data for autonomous systems, allowing vehicles to recognize roads, curbs, lane markings, traffic signs, and minor terrain changes. Unlike cameras, which rely on adequate lighting and can struggle in adverse conditions like rain, fog, or darkness, LiDAR functions reliably in all environments. Its ability to produce accurate 3D maps ensures that autonomous vehicles can safely navigate both congested urban streets and less defined rural paths, enhancing overall driving safety.

Enhanced Object Detection and Avoidance

One of the primary challenges for AVs is detecting and avoiding obstacles such as other vehicles, pedestrians, and debris. LiDAR’s ability to generate precise 3D models of the surrounding environment helps AVs identify objects and assess their distance and movement in real time. By tracking the trajectories of surrounding objects, LiDAR enables vehicles to anticipate and avoid collisions. The 360-degree coverage provided by LiDAR sensors enhances the vehicle’s situational awareness, ensuring that obstacles are detected from all directions. Whether merging onto highways, navigating intersections, or responding to sudden obstacles, LiDAR technology plays a crucial role in ensuring the safety of autonomous vehicles.

LiDAR: Driving the Future of Autonomous Vehicles with Precision and Safety
LiDAR: Driving the Future of Autonomous Vehicles with Precision and Safety 2

Real-Time Navigation and Decision-Making

Autonomous vehicles rely on multiple sensors, including cameras, radar, and LiDAR, to navigate in real-time. While cameras capture images of the road and radar tracks the speed and direction of nearby objects, LiDAR provides precise spatial data necessary for immediate decision-making. For instance, at a busy intersection, LiDAR allows the vehicle to determine the exact position and movement of surrounding vehicles, pedestrians, and cyclists. This data helps the vehicle choose the safest path and adjust its speed to avoid accidents. In dynamic environments where quick decisions are essential, LiDAR’s real-time data is critical for safe and efficient navigation.

Improving Safety in Adverse Conditions

While cameras and radar are essential for AV systems, they often falter in low-visibility conditions such as heavy rain, fog, or glare. LiDAR, however, excels in these situations, providing reliable performance even when visibility is compromised. Its laser-based technology allows autonomous vehicles to detect and interpret obstacles in poor conditions, offering a secure and dependable method for navigation. LiDAR’s continuous monitoring helps the vehicle’s control system detect sudden changes in road conditions or unexpected obstacles, ensuring safe operation even in challenging environments.

Advances in LiDAR Technology for Mass-Market Adoption

LiDAR technology is constantly evolving, with innovations like solid-state LiDAR reducing the size, cost, and complexity of the systems. These advancements are bringing LiDAR closer to widespread commercial adoption. The integration of artificial intelligence (AI) and machine learning further enhances LiDAR’s capabilities, improving the processing and interpretation of complex data. As autonomous vehicle technology matures, LiDAR will remain a critical component, working alongside other sensors to ensure safe and efficient navigation.

Conclusion: LiDAR as a Catalyst for the Future of Autonomous Vehicles

LiDAR technology is revolutionizing the development of autonomous vehicles by providing precise 3D mapping, real-time object detection, and reliable performance in all conditions. As LiDAR technology continues to advance, it will play a central role in the evolution of self-driving cars, enabling safer, more efficient, and economical vehicles. The future of autonomous driving is closely tied to the ongoing innovation in LiDAR, making it an indispensable tool in advancing self-driving technology.

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Delta Electronics Wins 2024 RE100 Leadership Award for Market Trailblazing in Renewable Energy

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Delta Electronics, a global leader in power management and IoT-based smart green solutions, has been honored with the 2024 RE100 Leadership Award in the Market Trailblazer category. The award, presented by the international renewable energy initiative RE100 during Climate Week NYC, highlights Delta’s exemplary efforts in overcoming market constraints and leading the transformation of the renewable electricity market through collaboration with global stakeholders. Delta stood out among 433 RE100 member companies for its commitment to renewable energy adoption and market leadership.

Delta’s Commitment to Renewable Energy and Sustainability

Ping Cheng, Delta’s Chairman and CEO, expressed pride in receiving the prestigious award, stating, “We are honored to receive this prominent accolade. RE100 is one of Delta’s core strategies for reducing our GHG emissions and achieving Net-Zero by 2050. It is a key performance indicator for our executives, and all of our global operation sites are actively adopting renewable electricity in compliance with local regulations.” Cheng emphasized that Delta’s achievement of RE76 in 2023 was a significant milestone, and the company is committed to accelerating its renewable energy initiatives to reach its sustainability goals.

RE100 Leadership Awards: Recognizing Industry Leaders in Renewable Energy

Since 2020, RE100 has presented the Leadership Awards annually during Climate Week NYC, recognizing companies that excel in promoting renewable energy. The 2024 awards included five categories: RE100 Changemaker, RE100 Market Trailblazer, RE100 Key Collaborator, RE100 Enterprising Leader, and Best Newcomer. Delta’s recognition as the Market Trailblazer underscores its role in leading renewable energy transformations, especially in emerging markets, where the company has demonstrated leadership through innovation and measurable impact.

Delta’s Renewable Energy Initiatives: Driving Global Market Change

Delta has actively contributed to renewable electricity development by signing power purchase agreements (PPAs) with wind, solar, and hydroelectric sources. In 2024, Delta purchased renewable electricity from Taiwan’s first government-led small hydropower plant, further advancing renewable energy diversity. In Thailand, home to some of Delta’s major production facilities, the company has worked closely with the government and other stakeholders to accelerate local renewable energy regulations and develop trading systems.

Comprehensive Strategy for Renewable Energy Adoption

Delta’s approach to advancing RE100 is built on its core energy conservation efforts, supported by internal carbon pricing (ICP). The company prioritizes self-generation photovoltaic systems in its buildings and, depending on regional regulations, prefers PPAs and green electricity products (GEPs) that bundle energy certificates with the electricity. Unbundled energy attribute certificates (EACs) are used as supplementary options, ensuring a flexible and comprehensive procurement strategy that continues to drive the renewable electricity market forward.

Conclusion: A Milestone in Delta’s Journey Toward Net-Zero by 2050

Delta’s 2024 RE100 Leadership Award is a testament to its unwavering commitment to renewable energy and sustainability. As the company accelerates its renewable energy initiatives and continues collaborating with stakeholders, it remains on track to achieve its ultimate goal of Net-Zero emissions by 2050, setting a strong example for other companies and industries to follow.

Broadcom Unveils Sian 2 DSP: Powering Next-Generation AI Cluster Connectivity with 200G/Lane Interfaces

Broadcom has introduced the Sian 2 DSP, featuring 200G/lane electrical and optical interfaces, designed to complement the existing Sian DSP with its 100G electrical and 200G optical support. These advancements enable pluggable modules with 200G/lane interfaces, laying the foundation for connecting next-generation AI clusters that demand faster, more efficient, and scalable network solutions.

As AI model sizes continue to grow, the need for high-performance, low-latency, and resilient connectivity becomes increasingly critical. To accommodate the rapid expansion of AI clusters, industry demands are shifting towards optical network solutions that offer higher bandwidth, reduced power consumption, and lower costs, all while ensuring optimal performance.

Transition from 400G/800G to 800G/1.6T for AI Cluster Growth

Currently, AI clusters are leveraging 400G/800G links with 100G/lane optics, but the increasing demands of AI workloads require a migration to 800G and 1.6T links with 200G/lane optics. The Sian 2 DSP is designed to facilitate this transition, ensuring AI clusters can scale up and scale out to support next-generation workloads.

Broadcom’s DSPs, optimized for 800G and 1.6T optical module platforms, deliver enhanced performance by doubling bandwidth while lowering power consumption, latency, and cost per bit—key factors in supporting AI data center growth.

Broadcom’s Commitment to AI Infrastructure

“200G/lane DSP is foundational to high-speed optical links for next-generation scale-up and scale-out networks in AI infrastructure,” explained Vijay Janapaty, vice president and general manager of Broadcom’s Physical Layer Products Division. He emphasized that the Sian family of products reinforces Broadcom’s leadership in optical DSP PHYs, enabling AI data center customers to deploy high-performance 800G and 1.6T links.

Best-in-Class Performance with Sian 2 DSP and 200G/Lane Optics

In addition to Sian 2, Broadcom’s optical portfolio includes 200G/lane optics such as electro-absorption modulated lasers (EML) and continuous wave lasers (CWL), which work seamlessly to deliver top-tier performance with optimized power efficiency. This combination enables data center operators to effectively scale AI workloads, driving down operational costs while enhancing performance.

AI Market Anticipates 200G/Lane Optical Module Adoption by 2025

Dr. Vlad Kozlov, CEO and Chief Analyst at LightCounting, noted that AI market leaders are expected to begin large-scale adoption of optical modules using 200G/lane interfaces by 2025. He highlighted the intense competition in the AI sector, with projections of over 1 million units of 1.6T optical transceivers to be deployed within the first 12 months—a scale-up rate unprecedented in the industry.

Conclusion: Driving the Future of AI with 200G/Lane Technology

Broadcom’s Sian 2 DSP represents a pivotal development in the quest for faster, more efficient AI cluster connectivity. By offering scalable, high-speed 200G/lane interfaces, Broadcom is enabling the AI industry to meet the growing demands of next-generation workloads, ensuring AI infrastructure can continue to evolve with minimal cost, power, and latency, while maximizing performance.

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